Samsung Electronics Co., Ltd.

Kwang-jai Yoo

Sang-ho Park

Jae-pil Shin

Moon-Hyun Yoo

Yoo-Hyon Kim

Dummy patterns are generated for a region of an integrated circuit that is divided into buckets by obtaining a local pattern density for a respective bucket and adjusting a density of the dummy pattern for the respective bucket as a continuously variable function of the respective local pattern density and a target density for the region. By providing a continuously variable dummy pattern density, the desired density of the dummy pattern group may be adjusted precisely, to thereby reduce or eliminate loading effects. The density of the dummy pattern for the respective bucket may be calculated according to a formula in which the density of the dummy pattern is continuously variable. The dummy patterns may include features of fixed pitch and a size of the features of fixed pitch is increased or decreased as a continuously variable function of the respective local pattern density and the target density for the region.

Continuously variable dummy pattern density generating systems, methods and computer program products for patterning integrated circuits

Embodiments of the present invention can provide systems, methods and/or computer program products that can obtain an effective pattern density of a layer of an integrated circuit from layout data that defines the layout. A grid of pattern cells is defined for the layout data. A respective pattern density is determined for a respective the pattern cell in the grid. An effective pattern density is calculated for a first pattern cell in the grid. The effective pattern density for the first pattern cell is a function of the pattern density of at least second pattern cell in the grid that is remote from (i.e. nonadjacent) the first pattern cell, and a distance of the at least a second pattern cell from the first pattern cell. Adjacent cells also may be included, and preferably are included, in the effective pattern density.

Systems, methods and computer program products for obtaining an effective pattern density of a layer in an integrated circuit, and for simulating a chemical-mechanical polishing process using the same

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Kyungki-do, South Korea

Kwang-jai Yoo