Inktec Co., Inc.

Intec Co., Ltd.

Kwang-Choon Chung

Hyun-Nam Cho

Young-Kwan Seo

Seong-Yong Uhm

Ji Hoon Yoo

Myoung-Seon Gong

Byung Woong Moon

Su Han Kim

Nam-Boo Cho

Yi-Sup Han

Jeong-Bin Park

Dong-Hun Nam

Joonki Seong

Chang-Soo Yu

Nam Boo Cho

Jung Yoon Moon

Hae-Sung Jung

Byung Hun Kim

Eun-Jin Park

Dae Hee Han

Myung Bong Yoo

Chang Soo Yu

Myung-Bong Yoo

Young-Koo Han

Baek Song Heo

In-Ha Kim

In-Sook Yi

Jeong-Guck Lee

Ki-Yong Kim

Insook Yi

Ki-Hun Kang

Jae Rin Kim

Young Chul Shin

Dae Sang Han

Hyeon-Jun Seong

Ju-Jin Choi

Hyoung-Seok Kim

Dong Hun Nam

Yun-Ho Jung

Hyun Nam Cho

Dae Seob Han

Myoung Seon Gong

Minhee Kim

Kwang-Baek Yoon

Su Phil Kim

Jung Ah Choi

Ji-Hoon Yoo

Kyong-Min Lee

Jae-Won Choi

Yi Sup Han

Dong-Lib Kim

Woong Ku On

Sung In Ha

Young-Chul Shin

Bae-Song Heo

Hyung-Ho Gil

Chung-Il Kim

Bong-Ki Jung

Nam Jung Kim

Hoo-Shick Kim

Nam-Boo 106-1204 Indeokwon Daewoo Apt Cho

Baek-Song Heo

Jae-won Choi

Seong-Youn Uhm

Min-Hee Kim

Mi-Kyoung Han

The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.

Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite

The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

Method for forming circuits using seed layer and etchant composition for selective etching of seed layer

The present invention relates to an etching solution composition for selectively etching only silver, a silver alloy, or a silver compound, and to a circuit forming method using the composition. The circuit forming method according to the present invention is characterized in that, in a substrate material in which an electrically conductive seed layer and a circuit layer are formed of heterogeneous metals, only the seed layer is selectively etched to enable the implementation of fine pitches. In addition, the present invention relates to a circuit forming method and an etching solution composition, wherein only a seed layer of silver (Ag), a silver alloy, or a silver compound is selectively etched without etching a copper (Cu) plated circuit.

Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

Microcircuit forming method and etching fluid composition

The present disclosure relates to an apparatus for manufacturing flexible printed circuit board (FPCB) and method for manufacturing the FPCB, having no limitations of length of a circuit pattern being formed on a base film.

Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB

The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.

Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same

Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.

Method for manufacturing a metal printed circuit board

Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Manufacturing method of double sided printed circuit board

Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.

Organic silver complexes, their preparation methods and their methods for forming thin layers

Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.

Method for making conductive pattern and conductive pattern

Provided herein is a method for forming a transparent electrode film, the method comprising forming an electrode pattern by printing an electrode pattern on a release film using a metal ink composition; forming an insulating layer by applying a curable resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; removing the release film; and forming a conductive layer by applying a conductive material on the electrode pattern from which the release film has been removed.

Method for manufacturing transparent electrode film

Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.

Method of manufacturing transparent electrode film for display and transparent electrode film for display

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

Conductive transparent substrate manufacturing method, and conductive transparent substrate

Provided herein is a method for producing a nano polaroid film using a one-pack type or two-pack type blackening ink so that a single layer film may replace a conventional polaroid film generally produced by superposing various types of optical films, and especially, a method for producing a nano polaroid film consisting of one film and having excellent observability by coating a transparent nano pattern substrate with a functional ink that contains a blackening material, and then removing particles formed on protruding portions using an etching solution, and refilling the functional ink into grooves.

Method for manufacturing polarizing film

Provided herein is a method for producing a hybrid transparent electrode, the method including filling grooves of a substrate with a conductive metal ink composition; filling the grooves with residue conductive metal ink composition that remains on a surface of the substrate as the grooves are being filled with the conductive metal ink composition to form an electrode pattern; and forming a conductive layer including a conductive material on the electrode pattern.

Method for manufacturing hybrid transparent electrode and hybrid transparent electrode

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Yongin-si, South Korea

Kwang-Choon Chung