Inktec Co., Inc.

Haeun Chemtec Co., Ltd.

Kwang-Baek Yoon

Young-Koo Han

Myung-Bong Yoo

Kwang-Choon Chung

Kwang Choon Chung

Nam-Boo Cho

Su-Han Kim

Kyong-Min Lee

Bong-Ki Jung

Hee-Yong Ahn

Young-Ho Han

Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Manufacturing method of double sided printed circuit board

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

Method for manufacturing a double-sided printed circuit board

Growing community of inventors

Gyeonggi-do, South Korea

Kwang-Baek Yoon