Hyundai Motor Company

Dae Ha Co., Ltd.

Kia Motors Corporation

Kia Corporation

Lg Hauseys, Ltd.

Kwan Suk Ryu

Chun Ho Park

Hee Joon Lee

Dong Eun Cha

Jin Young Yoon

Hyun Kyung Kim

Seung Ryong Jeong

Sun Jun Kwon

Ki Hyun Sung

Tae Kyung Lee

Ju-Hyun Ji

The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 &#x3bc;m/m&#xb7;&#xb0; C. to 90 &#x3bc;m/m&#xb7;&#xb0; C., an elastomer, and an inorganic filler.

Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same

A polypropylene resin composition includes: a base resin; a thermoplastic elastomer; and an inorganic filler; a major-axis diameter/minor-axis diameter, which is an aspect ratio of the inorganic filler, is 2 to 8. A molded product includes an injection molding of the polypropylene resin composition. The polypropylene resin composition may simultaneously impart excellent rigidity, impact resistance, and excellent dimensional stability even when applied to a molded product having a small thickness, while maintaining a low specific gravity.

Polypropylene resin composition and molded product thereof

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Asan-si, South Korea

Kwan Suk Ryu