Samsung Electronics Co., Ltd.

Kwan-Sik Cho

Bong-Soo Kim

Jin-Young Kim

Nam-Gun Kim

Sung-Il Cho

Hyun-Chul Yoon

Kyoung-ho Ha

Dong-jae Shin

Jae-man Yoon

Kwang-youl Chun

Hyun-il Byun

Dong-hyun Kim

Kwang-Hyun Lee

Seong-gu Kim

Ho-Chul Ji

Beom-suk Lee

Jung-hye Kim

Jung-Hyung Pyo

Jung-ho Cha

Jin-kwon Bok

Yong-hwack Shin

An optical device includes a substrate; a trench in a portion of the substrate; a clad layer arranged in the trench; a first structure arranged on the clad layer to have a first depth; and a second structure arranged on the clad layer to have a second depth different from the first depth.

Optical device and method of manufacturing the same

A semiconductor device having a cell area and a peripheral area includes a semiconductor substrate, a cell insulating isolation region delimiting a cell active region of the semiconductor substrate in the cell area, a word line disposed within the semiconductor substrate in the cell area, a bit line contact plug disposed on the cell active region, a bit line disposed on the bit line contact plug, a peripheral insulating isolation region delimiting a peripheral active region of the semiconductor substrate in the peripheral area, and a peripheral transistor including a peripheral transistor lower electrode and a peripheral transistor upper electrode. The bit line contact plug is formed at the same level in the semiconductor device as the peripheral transistor lower electrode, and the bit line electrode is formed at the same level in the semiconductor device as the peripheral transistor upper electrode.

Semiconductor devices including bit line contact plug and peripheral transistor

A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection.

Semiconductor package and semiconductor device including the same

Semiconductor devices including bit line contact plug and peripheral transitor

A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer.

Methods of fabricating semiconductor devices

Semiconductor devices including bit line contact plug and buried channel array transistor, and semiconductor modules, electronic circuit boards and electronic systems including the same

Growing community of inventors

Hwaseong-si, South Korea

Kwan-Sik Cho