Screen Holdings Co., Ltd.

Kurumi Yagi

Akiyoshi Nakano

Masafumi Inoue

An upper end of a tubular member surrounding a common pipe line is closed by a lid member. The lid member has an opening formed therein for supplying liquids to adjacent the rotation center on the back surface of a wafer. Deionized water supplied at normal temperature to the interior of the tubular member, after serving to cool the common pipe line, flows out of a lower end of the tubular member.

Substrate treating method

A substrate processing apparatus includes a spin chuck, a shielding member disposed over the substrate, a cup surrounding a spin base, an upper gas valve that makes an inert gas be discharged from a downward discharge port of the shielding member, and an exhaust duct that discharges a gas in the cup. The shielding member includes an opposed surface disposed over the substrate and an inner peripheral surface surrounding the substrate. The lower end of the inner peripheral surface of the shielding member is disposed in the periphery of the spin base. The distance in the radial direction from the lower end of the inner peripheral surface of the shielding member to an outer peripheral surface of the spin base is not less than the distance in the vertical direction from an upper surface of the substrate to the opposed surface.

Substrate processing apparatus

A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.

Growing community of inventors

Kyoto, Japan

Kurumi Yagi