Epcos Ag

Qualcomm Incorporated

Kurt Wiesbauer

Christian Block

Heinz Florian

Sebastian Brunner

Christian Korden

Holger Flühr

Günther Greier

Heinz Ragossnig

Johann Riedler

Edgar Schmidhammer

Pasi Tikka

Peter Hagn

Günter Pudmich

Christian Faistauer

Edmund Payr

Gerhard Fuchs

Pasi Lehtonen

Holger Fluehr

Andreas Haas

Franz Tinauer

Stefan Leitinger

Enrico Leitschak

Horst Uwe Faulhaber

Arne Eckau

Florian Rak

A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.

Package comprising a substrate that includes a stress buffer layer

A green film composed of varistor material laminated on a ceramic main body, which is provided with metallizations on both sides, and is sintered to form a varistor layer. A terminating electrode pair completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair can serve directly as a terminal contact for mounting an electrical component.

Component carrier having an ESD protective function and method for producing same

An antenna arrangement has a first signal path connected to a first antenna. A second signal path is connected to a second antenna. A third signal path includes a device that measures the signal strength. Directional couplers couple the first and second signal paths to the third signal path. Filters filter out signal components that are coupled by one antenna into the other antenna.

Antenna arrangement

A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

Front end module comprising an antenna switch

In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Configuration having an RF component and a method for compensation of linking inductance

A circuit array includes an antenna input, a signal input, a signal output, and a switch unit. The switch unit connects the antenna to either the signal input or the signal output. The antenna input is connected to a first productive device. The first protective device is a band-pass filter in a T configuration.

Bandpass filter electrostatic discharge protection device

A functional block of a front-end circuit for a communication device, which is employed for multi-band and/or multi-mode operation, is proposed. By positioning, according to this invention, a pin diode switch in one of the parallel signal paths instead of positioning it on the input side before separating the signal paths, it is possible to do without an impedance transformation network on the input side and to thus reduce the signal loss and the space requirement of the circuit. In a further configuration, the signal paths preferably associated with the adjacent frequency bands are combined on the output side, whereby the further processing of the signals corresponding to the different frequency bands takes place in one path. This for example allows a chip set designed for (n&#x2212;1) frequency bands to be used in a transmission system designed for n bands. Another embodiment of this invention enables monitoring of the received signal of a system even during operation of the other mode in a multi-mode system. Stable electrical properties of the circuit can be achieved according to this invention through integration of all components of the front-end circuit in one module.

Front-end circuit for wireless transmission systems

The invention relates to a circuit comprising an antenna input (), a signal input () and a signal output (), and a switching unit (), wherein the antenna input () is connected to a first protection device () against electrostatic discharges, said first protection device () being a band-pass filter in a &#x3c0;-configuration. The advantage of the first protection device () is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.

Circuit, switching module comprising the same, and use of said switching module

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Deutschlandsberg, Austria

Kurt Wiesbauer