Robert Boschgmbh

Kurt Weiblen

Frieder Haag

Helmut Baumann

Werner Herden

Stefan Pinter

Jiri Marek

Horst Muenzel

Frank Bantien

Markus Lutz

Hubert Benzel

Frank Schatz

Hans Hecht

Hans-Peter Trah

Johann Wehrmann

Juergen Kurle

Walter Roethlingshoefer

Thomas Beez

Andreas Kugler

Herbert Olbrich

Matthias Kuesell

Heinz Eisenschmid

Juergen Seiz

Eberhard Moess

Steffen Schmidt

Michael Munz

Uwe Lipphardt

Anton Doering

Joachim Dutzi

Karl Bender

Manfred Leiter

Juergen Nieder

Uwe Konzelmann

Rudolf Sauer

Bernhard Lucas

Manfred Vogel

Michael Offenberg

Anton Dukart

Christian Ohl

Ronny Ludwig

Jochen Franz

Gerhard Hueftle

Klaus Heyers

Wolfgang Kienzle

Oliver Kohn

Klaus Reymann

Josef Kleinhans

Dieter Tank

Dietrich Schubert

Michael Arndt

Rolf Becker

Conrad Haeussermann

Stefan Lehenberger

Bernhard Elsner

Florian Grabmaier

Ulrich Goebel

Andreas Duell

Eckart Reihlen

Tore Toennesen

Manfred Lembke

Helmut Bassler

Harald Emmerich

Martin Willmann

Franz Schmich

Axel-Werner Haag

Andreas Stratmann

Klaus Kasten

Klaus Offterdinger

Udo Jauernig

Kurt Ingrisch

Hans-Martin Irslinger

Hansjoerg Beutel

Michael Honer

Peter Tauber

Waldemar Guenther

Alexander Kromer

Jurgen Kurle

Klaus Jaeckel

Berhard Lucas

Helmeut Baumann

Botho Ziegenbein

Bertram Woessner

Dieter Arand

Rainer Jeske

Henninge Marberg

Guenther Frick

Andreàs Stratmann

Helmüt Grutzeck

Conräd Haeussermann

Gerhard Wiest

A receptacle is provided for accommodating an analysis chip, which receptacle has openings in a housing having access to the analysis chip, which openings are protected from external influences by a movable protector, and for carrying out an analysis, a mechanism for moving the protector is provided such that an opening in the protector coincides with the receptacle openings.

Container for an analysis chip

A force measurement element measures an introduced force by means of a double flexural beam and a displacement sensor. The double flexural beam makes possible a double spring shape that makes possible an optimization with regard to elongation distribution.

Force measurement element

A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

Sensor module

A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.

Chip assembly in a premold housing

A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Welding method

A device and method for measuring at least one of a force component and a torque component. The device includes a deformation member, for measuring at least one of a force component and torque component, a separate measuring element, configured to measure at least one force component, and an electronics unit, connected to the measuring element configured to evaluate a measuring signal of the measuring element. The deformation member includes a base part and at least one tongue movable with respect to the base part. The base part is arranged so that a gap between the measuring element and the tongue has a gap width variable in response to the force component introduced onto the deformation member. The measuring element is configured to convert a change in the gap width into a measuring signal. The method includes the step of changing the gap width between the tongue and the measuring element by introducing the force component into the deformation member. The method further includes the step of detecting the change in the gap width by the measuring element. The method further includes the step of directing the measuring signal by the measuring element to the electronics unit for further processing as a function of the change in the gap width.

Device and method for measuring a force component or torque component

A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

Method for producing a pressure sensor

An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board. To protect impact-sensitive and vibration-sensitive components, it is proposed to provide the contact elements, on a part of their length not inserted into the contact openings, with elastically deformable segments and to flexibly support the printed circuit board in the housing part by the contact element configured in this way, and, additionally, to connect it via damping elements at least indirectly to the housing part.

Electronic device

A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.

Sealed housing for an electronic device and the respective seal

A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.

Housing and methods of producing a housing

A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip.

Lead frame device and method for producing the same

A pressure sensor device has a mounting rack and a sensor casing arranged on the mounting rack and closed except for one opening. The pressure sensor includes a pressure pickup that is arranged inside the sensor casing and electrically connected to the mounting rack. Also included in the pressure sensor is a pressure connection which includes a connector and a pressure channel having an inlet and an outlet, with the pressure connection being designed as a molded part produced independently of the sensor casing and securable on the mounting rack. An outlet of the pressure channel designed on the molded part is connected at least indirectly to an opening in the sensor casing.

Pressure sensor connection device

The arrangement for producing electrical oscillations in a Giga hertz region has a Gunn element, a housing in which the Gunn element is accommodated and which has an electrically conductive housing cover, the Gunn element being in electrical contact with the electrically conductive housing cover, and an elastic, electrical contact element clamped between a contact surface of the Gunn element and the housing cover.

Arrangement for producing electrical oscillations

In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.

Method for manufacturing a pressure sensor

A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.

Housing for electronic component, and method of producing the same

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Metzingen, Germany

Kurt Weiblen