Siemens-albis, Ag

Kurt Schatzmann

Anton Forstner

To improve the solderability of the terminals or connections of integrated circuit components (IC-components) with parallel connection rows these must be pre-tin plated. An apparatus is disclosed which immerses the connections or terminals to be pre-tin plated as deeply as possible into the solder bath without exposing the components to impermissible thermal loads. This is obtained in that the components which are to be initially or pre-tin plated are tilted about an axis extending parallel to the terminal or connection row in a manner such that the connections of a row are simultaneously immersed into the solder bath.

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Dietikon, Switzerland

Kurt Schatzmann