Siemens Aktiengesellschaft

Siltronic Ag

Kurt Niederer

Peter-Christian Eccardt

Martin Vossiek

Thomas Scheiter

Frank Muemmler

Simon Zitzelsberger

Dieter Maier-Schneider

Goetz Meisterernst

Helmut Teroerde

Josef Berger

Celine Merel

Thomas K&ouml;lpin

Frank Mümmler

Götz Meisterernst

Helmut Terörde

A growing single crystal is supported in the region of a conical section of the single crystal via a supporting body during crystallization of the single crystal by the FZ method. The method comprises pressing the supporting body against the conical section of the growing single crystal at a temperature at which a first material of the supporting body becomes soft, and continuing pressing the supporting body against the conical section of the growing single crystal until the first material and a second material of the supporting body that remains hard at the cited temperature touch the conical section of the growing single crystal.

Method of supporting a growing single crystal during crystallization of the single crystal according to the FZ method

The damping of membranes of ultrasound transducers in an arrangement occurs at the front side directly on the membranes by applying a polymer layer, whereby the working temperature dependent on the operating frequency of the ultrasound transducer lies within the glass transition range of the polymer layer.

Arrangement of micromechanical ultrasound transducers

A micromechanical, capacitative ultrasound transducer having a planar membrane is adapted such for manufacturing an air gap between membrane and cooperating electrode that the membrane collapses. The width of the air gap is thereby defined by nubs located on the membrane that lie against the cooperating electrode.

Micromechanical, capacitative ultrasound transducer and method for the manufacture thereof

A spacer layer (,) with a cavity (,) etched out therein and a diaphragm (,) arranged thereabove on the spacer layer are located on a silicon substrate (,) with a doped region (,) formed therein, whereby the doped region and the diaphragm are electrically connected via terminal contacts (,) to electronic components (,) that are likewise integrated in the substrate (,). The electronic component are a component part of the operating circuit that can also be used for the drive of the diaphragm and for evaluating the diaphragm oscillations. The integration makes it possible to arrange the micromachined transducer components as array that can be electronically driven as phased array.

Surface micromachined ultrasonic transducer

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Eggenfelden, Germany

Kurt Niederer