Ciba-geigy Corporation

Vantico Limited

Huntsman Advanced Materials Americas LLC

Ciga-geigy Corporation

Kurt Meier

Martin Roth

Hans Zweifel

Roger P-e Salvin

Rolf Wiesendanger

Bernhard Sailer

Niklaus Buhler

Giuliano Eugster

Walter Fischer

Jurgen Finter

Kurt Dietliker

Godwin Berner

Rinaldo Husler

Theobald Haug

Martin Riediker

Wolfgang Scharf

Evelyn Fischer

Robert J Lunn

Jean-Francois Reber

Christoph Kroehnke

Heinz Wolleb

Beat Muller

Adrian Schulthess

Dieter Baumann

Ewald Losert

Ottmar Rohde

Milos Rusek

Roger Pierre-Elie Salvin

Sigrid Bauer

Armin Schaffner

Werner Margotte

Norbert M&uuml;nzel

Jean F Reber

Roger P Salvin

Franz Schwarzenbach

Ulrich Lacher

A carboxyl group-containing epoxy acrylate is prepared by the reaction of an epoxy resin advanced with an aromatic biphenol compound which is reacted with a polycarboxylic acid anhydride in the presence or absence of a catalyst and a polymerization inhibitor at an elevated temperature. The carboxyl group-containing epoxy acrylate is mixed with a photoinitiator to obtain a photoresist formulation.

Epoxy acrylate of aromatic biphenol-advanced epoxy resin reacted with anhydride

Epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Epoxy acrylates

Two sided printed circuit boards with very small rings surrounding the plated though holes can be produces by starting with a through-plated copper laminate, and coating it with a liquid negative electrodeposition photo-resist. The coated photo-resist is exposed to light through a mask set up so that the light does not shine on the through-platings. The non-crosslinked photo-resist is subsequently removed. A metal or a metal alloy resist is laid down by electrodeposition on those surfaces from which the non-crosslinked photo-resist has been removed. Finally, the crosslinked photoresist material is removed and the exposed copper laminate is treated with a copper-etching solution to completely remove the copper surface that has been uncovered.

Method for producing etched circuits

Method for producing multi-layer circuits

Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

The invention relates to mixtures containing:

Cationically polymerizable mixtures containing selected metallocene

Hardenable composition and its use

Compounds of the formula I ##STR1## in which X is O, S, SO, SO.sub.2 or NR.sub.13, R.sub.13 is, for example, methyl, and R.sub.1 to R.sub.12, independently of one another, are, for example, H, C.sub.1 -C.sub.12 alkyl, C.sub.1 14 C.sub.12 alkoxy, halogen or --CN. The compounds are photosensitive and photochromic and as suitable are photosensitizers and simultaneously as colour indicators, and as photoswitchable colour filters.

Photochromic composition

Cationically polymerizable compositions containing iron metallolene salt

Iron (II) metallocene salts

Compounds of the formula I ##STR1## in which X is O, S, SO, SO.sub.2 or NR.sub.13, R.sub.13 is, for example, methyl, and R.sub.1 to R.sub.12, independently of one another, are, for example, H, C.sub.1 -C.sub.12 alkyl, C.sub.1 -C.sub.12 Alkoxy, halogen or --CN. The compounds are photosensitive and photochromic and are suitable as photosensitizers and simultaneously as color indicators, and as photoswitchable color filters.

Photochromic compounds, a process for their preparation, and their use

The present invention relates to a negative photoresist consisting essentially of a process for the production of relief structures using

Process for the production of relief structures using a negative

Photocurable and solvent-developable compositions based on photopolymerizable (meth)acrylates, a photoinitiator for (meth)acrylates, an organic polymeric binder which comprises free carboxyl groups and has an acid number of at least 60, a blocked polyisocyanate crosslinking agent which has a cleavage temperature of at least 100.degree. C., and an inert solvent in an amount such that the photocurable composition is pourable, are described.

Photoresist

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Therwil, Switzerland

Kurt Meier