Sez Ag

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Lam Research Ag

Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag

Kurt Langen

Philip Engesser

A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

Device and process for liquid treatment of wafer-shaped articles

The invention relates to a process for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article. Furthermore the invention relates to a device for executing this process.

The invention concerns a device for an etch treatment of a disk-like object, in particular a wafer, having a means for receiving the disk-like object without contact and at least two guiding elements disposed normally to the means and limiting the position of the disk-like object at its periphery.

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Villach, Austria

Kurt Langen