Xerox Corporation

Kurt I Halfyard

T Brian McAneney

Gordon Sisler

Naveen Chopra

Christine Deborah Anderson

Chad Steven Smithson

Edward Graham Zwartz

Yiliang Wu

T Brian Mcaneney

Nan-Xing Hu

Michelle Chretien

Guiqin Song

Barkev Keoshkerian

Yu Qi

Raj D Patel

Biby Esther Abraham

Michael A Hopper

Sarah Jane Vella

Nicoleta D Mihai

Santokh Singh Badesha

Gabriel Iftime

C Geoffrey Allen

Carolyn Patricia Moorlag

Sandra J Gardner

Qi Zhang

Yujie Zhu

Brian McAneney

Peter Gordon Odell

Peter Michael Kazmaier

Ping Liu

Daryl Walter Vanbesien

Cuong Vong

James Daniel Mayo

Adela Goredema

Paul Farrell Smith

George Amos Gibson

H Bruce Goodbrand

Mihaela Maria Birau

Aurelian Valeriu Magdalinis

David J Sanders

Michelle N Chrétien

Danielle C Boils

David Michael Thompson

Fatima M Mayer

Michael J D'Amato

Fernando Perez Yulo

Adrien Pierre Côté

Michael James Diehl

Chris A Wagner

Gail Song

Samantha M Roland

Pedram Salami

Ed Zwartz

Alexander Vakov

Gord Sisler

Xan-Xing Hu

Nicoleta Mihai

Chad S Smithson

Michelle N Chretien

Chad Smithson

Biby E Abraham

Brian T Mcaneney

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

Hybrid nanosilver/liquid metal ink composition and uses thereof

A printable flexible overcoat ink composition that can be digitally printed is disclosed. For example, the printable flexible overcoat ink composition includes a mixture of a thermoplastic polyurethane (TPU) and a solvent. The mixture is mixed to have a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be digitally printed via an inkjet printhead or an aerosol jet printhead.

Printable flexible overcoat ink compositions

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising metal nanoparticles

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising eutectic metal alloy nanoparticles

Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

Interlayer printing process

There is described a point-of-purchase display and method. The display includes one or more sheets. The one or more sheets when unfolded and assembled form the display. The display includes a back wall, a front wall, at least a side wall and a bottom wall. A printed electronic device is affixed to a surface of the one or more sheets. The printed electronic device is selected from the group consisting of: wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, OLEDs and sensors. A microcontroller electrically is coupled to the printed electronic device. A connection device is coupled to the printed electronic device. A modular electronic component is coupled to the connection device.

Point-of-purchase (POP) display

An ink composition including a metal nanoparticle; at least one aromatic hydrocarbon solvent, wherein the at least one aromatic hydrocarbon solvent is compatible with the metal nanoparticles; at least one aliphatic hydrocarbon solvent, wherein the at least one aliphatic hydrocarbon solvent is compatible with the metal nanoparticles; wherein the ink composition has a metal content of greater than about 45 percent by weight, based upon the total weight of the ink composition; wherein the ink composition has a viscosity of from about 5 to about 30 centipoise at a temperature of about 20 to about 30&#xb0; C. A process for preparing the ink composition. A process for printing the ink composition comprising pneumatic aerosol printing.

Silver nanoparticle ink

A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25&#xb0; C., and a shear thinning index from about 1.0 to about 2.0.

Solder mask compositions for aerosol jet printing

A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 sand a temperature of 25&#xb0; C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

Method of aerosol printing a solder mask ink composition

Ink compositions are prepared by processes that include acoustically mixing a plurality of components at a resonance frequency. This encourages mixing of the components over a large range of viscosities with a minimal temperature rise and also shortens mixing time.

Methods for producing inks

A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20&#xb0; C. to about 130&#xb0; C. above the glass transition temperature of the thermoplastic binder and at least 120&#xb0; C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

Method of improving sheet resistivity of printed conductive inks

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Missassauga, Canada

Kurt I Halfyard