Schering Aktiengesellschaft

Kurt Heymann

Martin Bock

Christoph Donner

Rolf Rolff

Detlef Tenbrink

Martin Rimkus

Gunter Woldt

The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.

Method of forming a high temperature resistant copper coating on an

A process is disclosed for the adhesive metallization of ceramic materials by roughening of the materials and subsequent chemical and, if necessary, galvanic metal deposition, in which the materials are treated with an alkali hydroxide solution having a temperature from 50.degree. to 180.degree. C. for the roughening, and are subsequently heated to a temperature between about 300.degree. and 600.degree. C. The metal coatings provided on the ceramic materials display adhesive strengths from 3 to 5 kg/inch. Such materials find use in the fields of electrical engineering and electronics.

Process for the adhesive metallization of ceramic materials

A catalytic lacquer for the production of printed circuit boards using basic materials and metal deposition methods. The lacquer has the following composition: a binding agent based on synthetic or natural materials; water; a metal salt; a complex former; and a reducing agent. The binding agent may be a water soluble or dispersable compound. The metal salt may be a water soluble palladium, copper, silver, gold or nickel salt, preferably the sulphate. The complex former may be in the form of a compound forming stable complexes with metal ions. The reducing agent may be in the form of formaldehyde, hydrazine or its derivatives, boron compounds, sorbitols, phosphites, or hydrophosphites. The lacquer may also include an organic solvent or solvent mixture, preferably methylene chloride. A filler and stabilizer may also be included in the composition of the lacquer. The lacquer may be applied to base materials by means of silk screen printing, and then dried so that the metal seed layer is strengthened by the action of a metal deposition reduction bath.

Catalytic lacquer for producing printing circuits

In the pickling and activation of plastic surfaces with a chromo-sulfuric acid bath containing a noble metal chloride, the bath is boiled prior to use for a period of time sufficient to eliminate substantially all free chlorine present. Thereafter the plastic surface is pickled and activated in the bath, and then chemical metal plated.

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Berlin, Germany

Kurt Heymann