Hutchinson Technology Corporation

Mound Laser & Photonics Center, Inc.

Kurt C Swanson

Peter Francis Ladwig

Paul Valentine Pesavento

Michael Wayne Davis

Douglas P Riemer

John A Theget

Timothy A McDaniel

Joel B Michaletz

Philip W Anderson

Reed T Hentges

Steven A Fank

Jacob D Bjorstrom

Ryan N Ruzicka

Zachary A Pokornowski

Nole D German

Allan D Tokuda

Lance Nevala

Patrick R LaLonde

Jeffrey Wang

Brian D Boudreau

Matthew S Lang

Andrew J Peltoma

Joseph D Starkey

Peter Lawrence Titus

Paul D Borscheid

Kurt S Kruckman

Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.

High aspect ratio electroplated structures and anisotropic electroplating processes

A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

Gold electroplating solution and method

A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.

Process coupons used in manufacturing flexures

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

High-aspect ratio electroplated structures and anisotropic electroplating processes

A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

Chemically sharpening blades

A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.

Needle with rounded edge

A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.

Chemically sharpened blades

Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.

Electrical contacts to motors in dual stage actuated suspensions

Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer. The gold ground plane can be used as an etch stop during formation of the voids in the base layer.

Method for manufacturing an integrated lead suspension

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Hutchinson, MN, United States of America

Kurt C Swanson