Via Alliance Semiconductor Co., Ltd.

Kuo-Ying Tsai

Wen-Yuan Chang

Nai-Shung Chang

An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.

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Taipei, Taiwan

Kuo-Ying Tsai