Polytronics Technology Corporation

Kuo Hsun Chen

Yi An Sha

Hsiang Yun Yang

David Shau Chew Wang

Chun Teng Tseng

Wen Feng Lee

Shau Chew Wang

Jyh Ming Yu

Feng-Chun Yu

Kai-Wei Lo

Hsun Ching Chiang

Yu Hsuan Tseng

Yu Sian Jhuo

Ming Hsun Lu

Meng Chun Ko

Cheng Tsung Yang

A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Thermally conductive board

An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 &#x3a9;-cm and 0.45 &#x3a9;-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 &#x3a9;-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.

Over-current protection device

An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140&#xb0; C. The adhesive material has a heat conductivity greater than 3 W/m-K.

Adhesive material

An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm, and the insulating adhesive layer can withstand a voltage of at least 500 volts.

Illumination apparatus

A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 &#x3bc;m and at a temperature of 40&#xb0; C.

Heat radiating material

An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.

Over-current protection device and method of making the same

A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.

Heat conductive dielectric polymer material and heat dissipation substrate containing the same

A high voltage over-current protection device includes a positive temperature coefficient (PTC) electrically conductive heat-dissipation layer and two metal electrodes. The PTC electrically conductive heat-dissipation layer includes at least one polymer, an electrically conductive filler, and a heat conductive filler. Due to the high thermal conductivity of the heat conductive filler (with a coefficient of thermal conductivity higher than 1 W/mK), the high voltage over-current protection device has a high thermal conduction characteristic, and the withstand voltage thereof can be substantially uniformly distributed in the PTC electrically conductive heat-dissipation layer to enhance its high voltage withstanding characteristic.

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Kuo Hsun Chen