Pixart Imaging Incorporated

Pixart Imaging Incorporation

Pixert Imaging Inc.

Kuo-Hsiung Li

Chi-Chih Shen

Jui-Cheng Chuang

Hui-Hsuan Chen

Hung-Ching Lai

Wei-Chung Wang

Shang-Feng Hsieh

Jen-Yu Chen

Hsin-Chia Chen

Cheng-Nan Tsai

Cho-Yi Lin

Yen-Chang Chu

Yi-Chang Chang

Yen-Hsin Chen

Chih-ming Sun

Chin-Chou Lee

Yao-Ching Hsu

Fang-Sheng Hsu

There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.

Optical machine of smoke detector

There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

Miniaturized optical sensor package and manufacturing method thereof

An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Optical sensor package module and manufacturing method thereof

The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Optical module package structure and method thereof

An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.

Optical sensing module with multi-directional optical sensing function

The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.

Package structure

An optical touch panel includes a panel and a light guide module. The light guide module is disposed on the panel, and the light guide module includes a printed circuit board, at least one light emitting element, and a light guide strip. The light emitting element is electrically disposed on the printed circuit board. The light guide strip is disposed on the printed circuit board, and wraps the light emitting element. Additionally, the light emitting element emits light rays, and the light rays penetrate the light guide strip and are emitted to the panel.

Optical touch panel and light guide module thereof

A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are respectively combined with the cover body, the first chip module has an optical source, and the second chip module has an optical sensor. Further, the optical source and the optical sensor form a preset relative spatial position relation, such that a part of light emitted by the optical source is received by the optical sensor after at least one reflection.

Chip module package structure

In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse. In the above optical sensing module, since the packaging body is positioned on the lower surface of the printed circuit board and the shoulder portion is fixed thereon, a preciseness of assembling the above optical sensing module can be easily improved.

Optical sensing module and optical mouse with the same

The present invention discloses an optical touch control apparatus, comprising: a light guide module having an optical information capturing position, the light guide module guiding light to the optical information capturing position, and generating optical information according to light input through or reflected from the optical information capturing position; and an image sensor module for sensing the optical information, and generating an electronic signal according to the optical information.

Optical touch control apparatus and method thereof

A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.

Sensing module

An optical apparatus includes an optical semiconductor device and a lens assembly mounted on opposite surfaces of a substrate. The height of a surrounding wall and the thickness of a cover member of a semiconductor package of the optical semiconductor device are selected so that, when the cover member and the lens assembly abut directly against the opposite surfaces of the substrate, an optimum optical distance will be formed between a lens set of the lens assembly and a light-sensing portion of an optical semiconductor chip in the semiconductor package. A method for making the optical apparatus is also disclosed.

Growing community of inventors

Hsinchu, Taiwan

Kuo-Hsiung Li