Visual Photonics Epitaxy Co., Ltd.

Kuo-Hsiung Chang

Kun-Chuan Lin

Dong-Sing Wuu

Ray-Hua Horng

Sun-Chin Wei

Man-Fang Huang

Lung-Chien Chen

A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a metal-coated reflective permanent substrate and then removing the temporary substrate. The reflective metal layer also serves as a bonding agent for bonding the permanent substrate. The bonded LED element and permanent substrate are heated in a wafer bonding tool that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the bonded structure during the heating process to assist the bonding of the permanent substrate.

Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same

A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact layer with LED is used to bond the transparent substrate to form a dual substrate LED element which is then heated in a wafer holding device that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the dual substrate LED element during the heating process to assist the bonding of the transparent substrate.

Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same

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Tao-Yuan Hsien, Taiwan

Kuo-Hsiung Chang