Bgt Materials Limited

Other

Graphene Security Limited

Graphene Lighting China Limited

Kuo-Hsin Chang

Chung-Ping Lai

Jia-Cing Chen

We-Jei Ke

Jingyu Zhang

Yu Ngok Li

Wenbo Ma

Qiurong Liao

Chung- Ping Lai

Hsiao-Hsuan Shen

A portable hydrogen-containing ozone water humidifier including a housing with a mist outlet, a water tank for storing water, a hydrogen-containing ozone water generator, an ultrasonic atomizer for converting water into mist, a rechargeable battery and an electronic controller is revealed. An outlet pipe is connected to the bottom of the water tank and the hydrogen-containing ozone water generator is disposed on the outlet pipe for hydrolysis of the water to generate oxygen and ozone gas at an anode plate and hydrogen gas at a cathode plate and further get disinfectant water formed by ozone water mixed with hydrogen-rich water while the ultrasonic atomizer is arranged at an outlet end of the outlet pipe. The rechargeable battery provides power to the electronic controller, the hydrogen-containing ozone water generator, and the ultrasonic atomizer for driving them to work. The humidifier is compact and easy to carry.

Portable hydrogen-containing ozone water humidifier

A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.

Method of manufacturing a polymer printed circuit board

An LED lamp contains: a base, a casing, a support, multiple LED emitters, a cap, and a driver. The casing includes an accommodation chamber and an opening. The base includes at least one first conductive element. The support includes at least one second conductive element. Each of the at least one LED emitter includes: a first LED chip string having multiple first LED chips connected in series, a second LED chip string having multiple second LED chips connected in series, a substrate, a high-color-temperature phosphor layer, and a low-color-temperature phosphor layer. The driver is electrically connected with the at least one first conductive element and the at least one second conductive element. A total resistance value of the first LED chip string is different from a total resistance value of the second LED chip string.

LED lamp and LED emitter of the same

A light-emitting diode (LED) emitter and a LED lamp having the same are revealed. The LED emitter includes a first LED chip string, a second LED chip string, a substrate, two electrodes, a high-color-temperature phosphor layer and a low-color-temperature phosphor layer. The substrate where the first LED chip string and the second LED chip string are arranged is electrically connected to the two electrodes. The high-color-temperature phosphor layer and low-color-temperature phosphor layer cover the first LED chip string and the second LED chip string respectively. The total resistance value of the first LED chip string is different from the total resistance value of the second LED chip string.

LED emitter and LED lamp having the same

A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20&#xb0; C. to 100&#xb0; C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.

Heat dissipation coating layer and manufacturing method thereof

A method and an apparatus for regenerating batteries containing fluid electrolytes are revealed. The method includes the steps of: removing a case of a battery to expose a core of the battery, immersing the core in a functional electrolyte suitable for removing solid electrolyte interface (SEI) layer formed on surface of active materials, measuring characteristic parameters of the functional electrolyte during the period the core is immersed, adjusting concentration and electric conductivity of the functional electrolyte which the core is immersed therein by adding other suitable functional electrolytes according to the measured characteristic parameters until both the concentration and the electric conductivity are within a normal range of batteries or capacity of the core reaches the normal value of the battery. Thus the core is regenerated and re-packaged to form a regenerated battery.

Method and apparatus for regenerating battery containing fluid electrolyte

A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200&#xb0; C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Method of manufacturing a hexagonal boron nitride based laminate on LED filament

A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Method of manufacturing polymer printed circuit board

A printed RFID sensor tag contains: a substrate, a RFID sensor arranged on a top of the substrate, and a protective layer covering the RFID sensor. The RFID sensor includes a RFID sensing antenna and a chip adhered on the RFID sensing antenna. The RFID sensing antenna is partially or totally made of conductive sensing ink/glue printed on the top of the substrate, and the conductive sensing ink/glue consists of conductive ink/glue and multiple sensing materials.

Printed RFID sensor tag

An LED filament contains: a light transmissive substrate, at least one LED chip, a first electrode pin, a second electrode pin, a light emitting layer, and a phosphor layer. The phosphor layer packages the at least one LED chip, and the first electrode pin and the second electrode pin expose outside the phosphor layer. The light emitting layer is made of electromagnetic wave material of different radiation waves, the at least one LED chip produces excitation light source to excite the phosphor layer to illumine lights, and a part of the excitation light source of the at least one LED chip excites the light emitting layer to illuminate the lights after passing through the substrate. The part of the excitation light source excites phosphors of the light emitting layer to illuminate the lights toward the LED filament or the light emitting layer absorbs visible lights converted from infrared lights.

Filament structure and LED light bulb having the same

A light-emitting diode light bulb contains: a screw base, a transparent housing, at least one filament support, and at least one LED filament. The transparent housing includes an opening, and the screw base includes a positive terminal and a negative terminal. Each filament support includes two metal posts. Each LED filament includes a substrate, a first electrode pin, a second electrode pin, a thermal radiation film, at least one LED chip, a wire, and a fluorescent. The at least one LED chip is electrically connected with the first and second electrode pins, the first electrode pin is electrically connected with a first metal post, and the second electrode pin is electrically connected with a second metal post. The at least one LED filament and the at least one filament support are accommodated in the transparent housing, the screw base is housed into the opening, and the opening is closed.

Filament structure of LED light bulb

A RFID security structure for a document contains: a RFID antenna and a RFID chip. The RFID antenna is made of conductive inks printed on the document, and the RFID chip is attached on and is electrically connected with the RFID antenna. When the covering layer is removed from the document, the RFID antenna is broken. Accordingly, a portion of the RFID antenna attaches on the covering layer, and the other portion of the PRID antenna remains on the RFID security document or the substrate, hence the RFID security document is not tampered or is not imitated.

RFID security document

A wireless detectable diaper contains: a body and a shiftable-frequency RFID tag. The body includes a water-permeable lining layer, a waterproof layer, and an absorption layer. The RFID tag includes a chip and an antenna, wherein the antenna has a main part and an extending part, the extending part is arranged on a water-absorbing substrate, the extending part and the substrate contact with the absorption layer and are arranged on a wetting position of the body, and the main part and the chip are arranged on a non-wetting position of the body. When the body is not wet, a first frequency reading section of the antenna departs from a second frequency reading section of the monitoring equipment. The substrate absorbs urine or water in the absorption layer and is soaked by the urine or the water, such that a dielectric coefficient of the substrate is changed.

Wireless detectable diaper and monitoring equipment thereof

A bonding structure of a chip and an electronic circuit contains: a chip holder, a chip accommodated in the chip holder, multiple conductive feet electrically connected with the chip, and an electronic circuit. The chip and the multiple conductive feet are covered by a packaging material, and a part of each of the multiple conductive feet exposes outside the packaging material to form an extension. The electronic circuit includes a porous substrate and an electric circuit connected on the porous substrate, wherein the electric circuit is formed from conductive inks which penetrate into the porous substrate, and the extension is inserted through the electric circuit, hence the extension is electrically connected with the electric circuit.

Structure and method of bonding chip with electronic circuit

A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

Growing community of inventors

Chiayi, Taiwan

Kuo-Hsin Chang