United Microelectronics Corp.

Kuo-Feng Huang

Ming-Che Yang

Ching-Chih Cheng

En-Tien Tan

Hsien-Jung Hsu

Kuei-Hsi Lai

Hung-Lung Ma

Kuo-Chen Wang

Wen-Liang Fang

Eric Liu

Shih-Hsun Chiou

Hung-Lung Mar

Richard Leu

Kuei-Si Lai

Ching-Chiy Cheng

The present invention provides equipment for brushing the underside of a semiconductorwafer that is placed on a rotary wafer chuck. The equipment comprises a brush rod, a brush with a channel in it mounted at an end point of the brush rod, a nozzle for spraying water on the underside of the semiconductor wafer, and a driving device connected to the brush rod for driving the brush rod in a reciprocating motion. The wafer chuck rotates the semiconductor wafer and, simultaneously, water drives the blade and the brush to raise and rotate so as to spray water over the underside of the semiconductor wafer. The driving device drives the brush to brush the underside of the semiconductor wafer along a radial direction of the semiconductor wafer.

Equipment for brushing the underside of a semiconductor wafer

A liquid supplying device comprising a liquid container for storing a liquid so as to supply an external device and a liquid level sensor for detecting the liquid level. As the liquid within the liquid container is gradually used up, liquid level drops. As soon as the remaining liquid in the container drops to a predetermined amount, the liquid level sensor emits a warning signal to the operator, and the operator can then replenish the liquid in the container.

Liquid supplying device for providing chemical solution with a liquid level sensor

A supply apparatus comprises a storage tank, a chemical flow pipe to route a chemical solution into a semiconductor processing room, a pressurizing apparatus to supply gas to the storage tank to make the chemical solution flow into the processing room, and an electro-Pneumatic regulator valve to adjust the pressure of the input gas. The flow control device comprises a flow sensor, a set-up apparatus, and a processor for generating a control signal to the pressurizing apparatus depending on a difference between a target value and a measurement value to adjust the flow of the chemical solution in the chemical flow pipe. The flow sensor comprises a hollow cylinder, a choking magnetic core movably positioned inside the hollow cylinder, and a first and second conductive coil wrapped around the outer wall of the hollow cylinder which uses alternating current to generate a magnetic flux and sense a change in the magnetic flux to measure the flow of chemical solution.

Flow control device

A spray coating device for coating a rotating wafer according to the invention is disclosed. The spray coating device comprises a spray head having a plurality of spray holes which are located on one end thereof with more in number on both sides than on the center of the end for uniformly spraying a chemical liquid on the rotated wafer. Since spray holes are more in number on the both sides than on the center of the end, the rotated wafer can be uniformly spray coated with the chemical liquid even though several spray holes are congested.

Spray coating device

A dispensing system used in a spin coater is provided to transport a solvent to a wafer. The dispensing, system includes a switch valve, a sucking-back valve, a solenoid valve, a speed control unit of the sucking-back valve, and a speed control unit of the switch valve. The switch valve controls a solvent dispensing status. The sucking-back valve receives the solvent from the switch valve and exports the solvent to a wafer. The solenoid valve controls the switch valve and the sucking-back valve. The speed control unit of the switch valve is coupled between the switch valve and the solenoid valve and is used for a control of action speed on the switch valve. The speed control unit of the sucking-back valve is coupled between the switch valve and the sucking-back valve, and is used for a control of action speed of the sucking-back valve by a sufficient delay time of action.

Dispensing system of a coater

A jet-cleaning device for a developing station, especially suitable for installing on a wafer back cleaning ring of a CLEAN TRACK MK-V developing station. The jet-cleaning device is used for cleaning the wafer back of a wafer mounted above a spinner. The jet-cleaning, device comprises a jet-cleaning block and a vertical nozzle. The jet-cleaning block has a nozzle groove having an inlet for pumping in a cleaning solution. The vertical nozzle is connected to the nozzle groove for forming a vertical jet of the cleaning solution so that waste liquid on a wafer back can be removed.

Jet-cleaning device for developing station

A photoresist dispensing system used in a photoresist coating machine includes a pump, a sucking-back valve, a solenoid valve, a first pump speed controller, a second pump speed controller and a sucking-back speed controller. The pump is used to transport photoresist and spray a substrate. The sucking-back valve is used to suck back liquid photoresist from a transporting duct end. The solenoid is used to activate or inactivate the pump and the sucking-back valve. The first and the second pump speed controllers are separately coupled between the pump and the solenoid valve, and the sucking-back speed controller is coupled between the sucking-back valve and the sucking-back speed controller is coupled between the sucking-back valve and the route, where is between the pump and the second pump speed controller. Hence, the sucking-back valve produces a sucking force after the pump is inactivated and releases a sucking force after pump is activated.

Dispense system of a photoresist coating machine

A SOG coater nozzle pot includes a pot for containing fluid and letting the fluid in the pot flow out, a funneled nozzle including a wider opening for receiving fluid from the pot and a narrower opening on a protuberance inserted into a duct, and a mounting device for mounting the funneled nozzle on the SOG coater. The nozzle pot according to the invention makes the mounting/dismounting operations of the pot more convenient and less time-consuming. The stability of the SOG coater is maintained as well.

SOG coater nozzle pot

A speed controller with scales according to the invention is used to adjust the amount of an air flow thereby to control the amount of a chemical liquid sprayed. The speed controller includes a housing, a controller body and a transparent tube. The controller body is partly inserted in the housing and has a rotary button located at one end thereof and outside the housing. The rotary button has a slot and an indicator thereon, wherein the indicator is located at one end of the slot. The transparent tube, having a vertical scale on the side thereof and a circular scale on the top circumference thereof, encloses the rotary button. In the invention, the position of the rotary button can be determined by reading the vertical scale and the circular scale so as to precisely control the amount of a chemical liquid sprayed, thereby increasing yield and improving engineering analysis.

Growing community of inventors

Chu-Pei, Taiwan

Kuo-Feng Huang