Kinsus Interconnect Technology Corp.

Quanta Computer Incorporated

Kuo-Chun Huang

Ting-Hao Lin

Yu-Te Lu

Shuo-Hsun Chang

Yi-Fan Kao

Kai-Ju Cheng

Rong-Quen Chen

Shih-Hsiang Lo

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

A connection adapter is provided. In certain configurations, the connection adapter includes an input portion with a plurality of sets of input connectors, a first output portion extending from the input portion in a first direction and including a first set of output connectors, and a second output portion extending from the input portion in a second direction and including a second set of output connectors. In the connection adapter, the sets of input connectors are electrically coupled to each of the first set of output connectors and the second set of output connectors. Further, the first and second directions are substantially perpendicular to each other, while the input portion extends in a third direction that is not substantially perpendicular to the first direction or the second direction.

Universal connection adapter

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

An acoustic echo cancellation (AEC) system includes a remote device, for capturing a remote captured sound, a server coupled to the remote device, and a local device coupled to the server. The server transmits the remote captured sound from the remote device to the local device. The local device receives, stores and plays the remote captured sound as a local playback sound. An echo is generated from reflection of the local playback sound. The local device captures the echo and a local sound into a local captured sound, and transmits both the remote captured sound and the local captured sound to the server. The server performs AEC on the local captured sound by using the remote captured sound from the local device and transmits the AEC processed local captured sound to the remote device.

Growing community of inventors

Taoyuan, Taiwan

Kuo-Chun Huang