Innolux Corporation

Kuo-Chang Chiang

Kuan-Feng Lee

Tzu-Min Yan

Kuei-Ling Liu

Peng-Cheng Huang

Tsau-Hua Hsieh

Jui-Feng Ko

A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

Fabricating method for display apparatus

A display apparatus and a fabricating method for a display apparatus are provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

Display apparatus and fabricating method for display apparatus

A thin film transistor includes a gate electrode, a semiconductor layer, a source electrode, a drain electrode, a first protective layer, and a second protective layer. The gate electrode is disposed on a substrate. The metal oxide semiconductor layer is disposed on a gate insulating layer and electrically connects the source electrode and the drain electrode. The first protective layer disposed on the metal oxide semiconductor layer has a first oxygen vacancy concentration. The second protective layer disposed on the first protective layer has a second oxygen vacancy concentration. A boundary area located between the first and second protective layers has a third oxygen vacancy concentration. The third oxygen vacancy concentration is respectively greater than the first oxygen vacancy concentration and the second oxygen vacancy concentration.

Thin film transistor substrate and display panel using the same

A display panel is provided, which includes a first substrate, a first insulating layer on the first substrate, a semiconductor layer on the first insulating layer, and a second insulating layer on the semiconductor layer and the first insulating layer. The second insulating layer has a surface in contact with the first insulating layer. The second insulating layer has a first region. The first region has a thickness of 40 nm from the surface of the second insulating layer, and the second insulating layer has a fluoride ion gain ratio of 80% to 95% in the first region.

Display panel

A display panel is provided. The display panel includes a color filter substrate. The color filter substrate includes a first substrate, a black matrix, a color filter layer, a transparent conductive layer, and a plurality of spacers. The black matrix and the color filter layer are disposed on the first substrate. The transparent conductive layer is disposed on the color filter layer and the black matrix, and has a plurality of openings located above the black matrix. The spacers are located on the transparent conductive layer and located on the black matrix. At least one of the openings is located between the adjacent spacers, and at least one of the spacers partially overlaps at least one of the openings.

A display panel is provided. The display panel includes a first substrate having a display area and a non-display area. A sealant is disposed on the first substrate and on the non-display area. A planarization layer is disposed on the first substrate. The planarization layer has a first trench formed therein on the non-display area. The first trench has a bottom and a side adjacent to the bottom. The bottom has a roughness that is greater than the roughness of the side.

Display panels

A display device is provided. A thin film transistor structure of the display device includes a substrate, a gate electrode disposed on the substrate, a gate insulation layer disposed on the substrate and the gate electrode, a channel layer on the gate insulation layer and corresponding to the gate electrode, and a source electrode and a drain electrode contacting two sides of the channel layer, respectively, and extending onto the gate insulation layer. The channel layer includes a first metal oxide semiconductor layer, which includes (1) tin and (2) at least one of gallium, hafnium, and aluminum.

Display device

A display panel is disclosed, comprising: a first substrate; a thin film transistor layer disposed on the first substrate; an insulating layer disposed on the thin film transistor layer; at least one pixel electrode disposed on the insulating layer and exposing an exposure region of the insulating layer; and an alignment layer disposed on the pixel electrode and the exposure region; wherein a surface roughness of the alignment layer disposed on the exposure region is larger than a surface roughness of the alignment layer disposed on the pixel electrode.

A display panel is provided, which includes a first substrate, a first insulating layer on the first substrate, a semiconductor layer on the first insulating layer, and a second insulating layer on the semiconductor layer and the first insulating layer. The second insulating layer has a surface in the vicinity of the first insulating layer. The second insulating layer has a first region. The first region is 40 nm in depth starting from the surface of the second insulating layer, and the second insulating layer has a fluoride ion gain ratio of 80% to 95% in the first region.

Growing community of inventors

Miao-Li County, Taiwan

Kuo-Chang Chiang