Industrial Technology Research Institute

Iteq Corporation

Kuo-Chan Chiou

Feng-Po Tseng

Kuei-Yi Chuang

Lu-Shih Liao

Tzong-Ming Lee

Yen-Chun Liu

Chen-Lung Lin

Hui-Wen Chang

Chun-Yi Chiu

Shou-Yi Ho

Wei-Han Hsiao

Min-Chian Wang

Hsiang-Yen Tsao

Ming-Chia Li

Hong-Ching Lin

Ruoh-Huey Uang

Chun-An Lu

Yi-Ting Cheng

Wen-Hsien Wang

Yu-Ming Wang

Min-Tsung Kuan

Jia-Chi Huang

Hsien-Lin Hu

Fang-Yao Yeh

Jun-Rong Chen

Yi-Chi Yang

Wen-Pin Ting

Szu-Po Huang

Hsin-Mei Chen

Meng-Ju Wu

Tzu-Ting Lin

A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.

Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained thereby

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II) wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), wherein R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, q, z and E are as defined in specification.

Reversible crosslinking reactant composition

The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.

Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

Resin composition and method for manufacturing thermally conductive material

A modified copolymer is provided. The modified copolymer includes a random copolymer of a repeat unit of formula (I) and a repeat unit of formula (II) wherein M is derived from monomers with double bonds, R is a direct bond or an aliphatic hydrocarbon chain group having 1 to 12 carbon atoms, a cyclic aliphatic hydrocarbon group having 3 to 16 carbon atoms, an alkylcarbonyloxy group having 2 to 6 carbon atoms, a carbonyl group, an ether group, an ester group, an amide group, an aromatic group having 6 to 16 carbon atoms, or a divalent group having any of the above groups, wherein m and x are positive integers less than 50. The weight average molecular weight of the modified copolymer is between 3000 and 30000.

Modified copolymer, method for preparing the same, and method for preparing paste

The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I:  When formula I represents a compound, x is an integer of 1&#x2dc;5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, &#x2014;O&#x2014;, &#x2014;N&#x2014;, &#x2014;Ar&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;Ar&#x2014;O&#x2014;(CH)&#x2014;, &#x2014;Ar&#x2014;O&#x2014;(CH)&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;O&#x2014;(CH)&#x2014; or &#x2014;(CH)&#x2014;CH(OH)&#x2014;(CH)&#x2014;NH&#x2014;; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.

Furan-modified compound and oligomer

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer having a structure represented by Formula (I) and a bismaleimide compound having a structure represented by Formula (II), wherein the equivalent ratio of the furan group of the furan-group-containing oligomer having a structure represented by Formula (I) to the maleimide group of the bismaleimide compound having a structure represented by Formula (II) is from 0.5:1 to 1:0.5.

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which Ris &#x2014;CH&#x2014;, &#x2014;C(&#x2550;O)&#x2014;, or &#x2014;(CH)&#x2014;(CH)&#x2014;, and Ris H or CH.

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Yand Yare independently &#x2014;H, &#x2014;CH, or &#x2014;CHCH; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.

Polymers and resin composition employing the same

A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, Xis Xis m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

Thermally conductive resin and thermal interface material comprising the same

A transparent conductive film composite is provided. The transparent conductive film composite includes (a) 0.07-0.2 wt % of a metallic material; (b) 0.01-0.5 wt % of a dispersant; and 99.3-99.92 wt % of a solvent, wherein the metallic material (a) includes: (a1) 84-99.99 wt % of metal nanowires; and (a2) 0.01-16 wt % of micron metal flakes. A transparent conductive film manufactured from the transparent conductive film composite is also provided.

Transparent conductive film composite and transparent conductive film

An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4&#x2032;-ethylenedianiline, 4,4&#x2032;-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

Epoxy resin compositions and thermal interface materials comprising the same

Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.

Conductive paste composition and method for manufacturing electrode

A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided.  In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, &#x2014;O&#x2014;, &#x2014;S&#x2014; or &#x2014;SO&#x2014;, X includes &#x2014;H, &#x2014;CHor &#x2014;CHCH, Rincludes &#x2014;H, &#x2014;CHor &#x2014;CHCH, and E includes &#x2014;H, &#x2014;CHor &#x2014;CHCH.

Resin formulations, resin polymers and composite materials comprising the resin polymers

A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25&#xb0; C. to 2,900&#xb0; C.

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Tainan, Taiwan

Kuo-Chan Chiou