Vlsi Technology Research Association

Kunizou Sahara

Kanji Otsuka

Katsumi Ogiue

Kazumichi Mitsusada

Masao Sekibata

A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.

Growing community of inventors

Kodaira, Japan

Kunizou Sahara