Sony Corporation

Kuniyuki Hayashi

Takayuki Hirabayashi

Akihiko Okubora

Takahiko Kosemura

Tatsuya Ogino

The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board () whose main surface is formed as a build-up surface () and a high frequency circuit part () formed on the build-up surface of the base board () and having passive elements formed. The base board () has an area () in which wiring is not formed in a lower layer from a fourth wiring layer (). The high frequency circuit part () has an upper electrode part () and a lower electrode part () in positions corresponding to the area () in which the wiring is not formed. Thus, since a capacitance () is provided just above the area () in which the wiring is not formed, a parasitic capacity that the capacitance () receives from ground patterns () is reduced. Accordingly, the characteristics of the capacitance () can be improved.

High frequency module board device

The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board () having a high-frequency element layer forming surface () formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (); and a high-frequency element layer part () having a passive element and a circuit element for receiving power or a signal supplied from the base board () via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface () of the base board (). The base board () has a distributed constant circuit () formed by pattern wiring.

High-frequency module and its manufacturing method

The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate ( ) which has multiple pattern wiring layers ( ) ( ) ( ) ( ) and dielectric insulating layers ( ) ( ) ( ) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer ( ) formed on the buildup surface, which has an inductor ( ) formed therein via an insulating layer ( ) formed on the buildup surface. The base substrate ( ) is provided with a region ( ) where the pattern wiring layers ( ) ( ) ( ) ( ) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor ( ) of the high-frequency element layer ( ) is formed directly above the region ( ).

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Oita, Japan

Kuniyuki Hayashi