The Furukawa Electric Co., Ltd.

Fuji Electric Co., Ltd.

Furukawa Automotive Systems Inc.

Kuniteru Mihara

Tatsuhiko Eguchi

Shigeki Sekiya

Kyota Susai

Kiyoshige Hirose

Satoshi Suzuki

Yoshinari Ikeda

Isao Takahashi

Yoshikazu Takahashi

Hiromichi Gohara

Nobuyuki Tanaka

Ryoichi Kato

Hiroshi Kaneko

Takashi Miyoshi

Takeo Uno

Chikahito Sugahara

Naofumi Tokuhara

Katsumasa Hasegawa

Katsuhiko Uda

A semiconductor device, including a conductive plate having a front surface that includes a plurality of bonding regions and a plurality of non-bonding regions in peripheries of the bonding regions, a plurality of semiconductor elements mounted on the conductive plate in the bonding regions, and a resin encapsulating therein at least the plurality of semiconductor elements and the front surface of the conductive plate. The conductive plate has, at the front surface thereof in the non-bonding regions, a plurality of holes.

Semiconductor device and method of manufacturing semiconductor device

An aluminum alloy conductor, containing: 0.01 to 0.4 mass % of Fe, 0.1 to 0.3 mass % of Mg, 0.04 to 0.3 mass % of Si, 0.1 to 0.5 mass % of Cu, and 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and inevitable impurities, wherein the conductor contains three kinds of intermetallic compounds A, B, and C, in which the intermetallic compounds A, B, and C have a particle size of 0.1 &#x3bc;m or more but 2 &#x3bc;m or less, 0.03 &#x3bc;m or more but less than 0.1 &#x3bc;m, and 0.001 &#x3bc;m or more but less than 0.03 &#x3bc;m, respectively, andarea ratios a, b, and c of the intermetallic compounds A, B, and C, in an arbitrary region in the conductor, satisfy: 0.1%&#x2266;a&#x2266;2.5%, 0.1%&#x2266;b&#x2266;3%, and 1%&#x2266;c&#x2266;10%.

Aluminum alloy conductor

An aluminum alloy wire material, which has an alloy composition containing: 0.1 to 0.4 mass % of Fe, 0.1 to 0.3 mass % of Cu, 0.02 to 0.2 mass % of Mg, and 0.02 to 0.2 mass % of Si, and further containing 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and unavoidable impurities, in which a grain size is 5 to 25 &#x3bc;m in a vertical cross-section in a wire-drawing direction of the wire material, in which, according to JIS Z 2241, a tensile strength (TS) is 80 MPa or more, an elongation (El) is 15% or more, and a 0.2% yield strength (YS; MPa) satisfies, together with the TS, a relationship represented by formula: 1.5&#x2266;(TS/YS)&#x2266;3, and in which an electrical conductivity is 55% IACS or more.

Aluminum alloy wire material

A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that includes (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 &#x3bc;m, and the precipitate Y has a grain size of 0.01 to 1 &#x3bc;m.

Copper alloy

A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities,

Copper alloy for electric and electronic equipments

A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 &#x3bc;m or below; and a method of producing the same.

Copper alloy for electronic machinery and tools and method of producing the same

A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 &#x3bc;m to 2 &#x3bc;m, the intermetallic compound B has a compound diameter of 0.05 &#x3bc;m to less than 0.3 &#x3bc;m, and the intermetallic compound C has a compound diameter of more than 0.001 &#x3bc;m to less than 0.05 &#x3bc;m.

Copper alloy strip material for electrical/electronic equipment and process for producing the same

An electrical contact comprising a silver-coated stainless steel strip, which has an underlying layer comprising any one of nickel, cobalt, nickel alloys, and cobalt alloys, on at least a part of the surface of a stainless steel substrate, and has a silver or silver alloy layer formed as an upper layer, in which a copper or copper alloy layer with a thickness of 0.05 to 2.0 &#x3bc;m is provided between the silver or silver alloy layer and the underlying layer; and a producing method of the above-described electrical contact, in which the silver-coated stainless steel strip is subjected to a heat-treating in a non-oxidative atmosphere.

Silver-coated stainless steel strip for movable contacts and method of producing the same

A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.

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Tokyo, Japan

Kuniteru Mihara