Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Kunisaburo Tomono

Hiroshi Marusawa

Takehiro Konoike

Takehiro Kounoike

Takashi Kawanami

Harufumi Mandai

Harunobu Sano

Yukio Hamaji

Hiroshi Takagi

Yukio Sakamoto

Toshio Kawabata

Takashi Kodama

Kozo Moriyasu

Toshiya Oshima

Takashi Ohsawa

Takashi Toda

Mitsuhiro Fukushima

Takashi Hasegawa

Michihiro Murata

Yasuyuki Naito

Toshimi Kaneko

Iwao Fukutani

Takeshi Tanabe

Akihiro Nakamura

Kosuke Shiratsuyu

Yasuo Fujiki

Haruhumi Mandai

Kiyoshi Hase

Eiji Imamura

Takashi Kumokawa

Hideo Ajichi

Hiromichi Sakai

Sakiko Iwamoto

Fumio Nakayama

Hidemichi Mori

Toyoaki Tsunematsu

Koji Kajiyoshi

A composite magnetic material comprises a ferrite powder and a resin in which the powder comprises a spinel type ferrite including at least Ni and Co.

Composite magnetic material and inductor element

A laminated electronic component includes a composite obtained by integrally sintering a plurality of laminated magnetic layers, internal conductors being formed in the interior of the composite. The internal conductor and the magnetic layers constitute a plurality of inductance elements, or an inductance element and a capacitance element. The magnetic layer has a composition containing a primary component comprising 45 to 50 mole percent Fe O , 0 to 33 mole percent ZnO, and 6 to 20 mole percent CuO, and the balance being NiO, and a Mn compound wherein the Mn compound is contained in an amount of 0.01 to 2.0 weight percent as MnO in the composition.

Laminated electronic component

An outer sheath for an electronic device which includes an electronic element is formed by placing a thermosetting resin on the outer surface of the electronic element to form a first thermosetting resin layer, placing a thermoplastic resin on the outer surface of the first thermosetting resin layer to form a thermoplastic layer and placing a thermosetting resin layer on the thermoplastic layer to form a second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layers and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.

Method of producing an electronic device having a sheathed body

A composite magnetic material comprises a ferrite powder and a resin, in which the ferrite powder comprises a cobalt substituted Y type hexagonal ferrite (2BaO.2CoO.6Fe O ) or cobalt substituted Z type hexagonal ferrite (3BaO.2CoO.12Fe O ), and the permeability at 2 GHz is 90% or more of that at 1 MHz.

A method of producing a Ni&mdash;Cu&mdash;Zn ferrite material comprises the steps of preparing a mixture of an iron compound powder having a specific surface area of about 8.5 m,/g or more, a nickel compound powder, copper compound powder and a zinc compound powder, the mixture having a specific surface area of about 8.0 m,/g or more; pre-calcining the mixture such that the pre-calcined mixture has a surface area of about 5.0 m,/g or more and a spinel crystal synthesizability within a range of about 80.5% to 98%; and milling the pre-calcined mixture to obtain a powder of a Ni&mdash;Cu&mdash;Zn ferrite material having a specific surface area of about 6.0 m,/g or more.

Method of producing Ni-Cu-Zn ferrite material

An electronic device 1 includes an electronic element 3 having an outer sheath 5 covering at least substantially the entire outer surface of the electronic element. The outer sheath 5 has three layers: a first thermoplastic layer 5a formed on at least substantially the entire outer surface of the electronic element; a thermoplastic resin layer 5a formed on at least substantially the entire outer surface of the first thermosetting layer 5a, and a second thermoplastic resin layer 5b formed on at least substantially the entire outer surface of the thermoplastic layer. The outer sheath is formed by placing an uncured thermosetting resin on the outer surface of the electronic element to form the first thermosetting resin layer placing an uncured thermosetting resin on the outer surface of the first thermosetting resin layer to form the thermoplastic layer and placing an uncured thermosetting resin layer on the thermoplastic layer to form the second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layer and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.

Electronic device having a sheathed body and a method of producing the

A high-frequency circuit element which can be formed by firing simultaneously a microwave magnetic body and a hard magnetic body plate in the form of a laminate. The microwave magnetic body is made of calcium-vadium-iron and the hard magnetic body plate is made of strontium-iron, so that they have approximately the same firing temperature. They are separated by a screening film of palladium or platinum, which prevents the diffusion of strontium ions from the hard magnetic body plate to the microwave magnetic body. This constitution permits the simultaneous firing of the two components. The high-frequency circuit element is useful as a small, high-precision circulator, isolator, or inductor.

High-frequency circuit element

A laminated capacitor and a process for producing the same. The laminated capacitor includes a plurality of capacitor assemblies and external electrodes, the capacitor assemblies each including a thermoplastic resin film having consecutively thereon a metal film as a first internal electrode, an inorganic dielectric material film, and a metal film as a second internal electrode, the plurality of capacitor assemblies being laminated with each other to form a laminated body, the external electrodes each being provided on an end surface of the laminated body, on which the first or second internal electrode is exposed, and being electrically connected to the first and second internal electrodes, respectively.

Laminated capacitor and process for producing the same

A three-component piezoelectric ceramic composition having a large electro-mechanical coupling coefficient and high mechanical strength, composed of xPb(Mg.sub.w/3 Nb.sub.1-w/3)O.sub.3 -yPbZrO.sub.3 -zPbTiO.sub.3, is adapted so as to place points representing the compositional proportions x, y, and z (x+y+z=1) on lines connecting points

Piezoelectric ceramic compositions

A microwave non-reciprocal circuit element which is further miniaturized and of low losses without causing conductor losses in center electrodes following miniaturization. The microwave non-reciprocal circuit element according to the present invention comprises a plurality of center electrodes which are arranged to intersect with each other in a state electrically insulated from each other, and a microwave magnetic or dielectric body which is arranged on an intersecting portion of the plurality of center electrodes, and the respective center electrodes are formed by a plurality of conductors 55, 56 and 57 which are stacked through the microwave magnetic or dielectric body.

Microwave non-reciprocal circuit element

A high-frequency non-reciprocal circuit element comprises a high-frequency-use magnetic layer and a plurality of center electrodes arranged therein to intersect with each other while being electrically insulated from each other. The plurality of center electrodes are advantageously embedded in the high-frequency-use magnetic layer or layers to be integrated with the same.

Method of making a high frequency non-reciprocal circuit element

A microwave magnetic material body for use in a microwave non-reciprocal circuit element is constructed by sintering a laminated body obtained by laminating a plurality of magnetic sheets.

Method of manufacturing microwave magnetic material body

A magnetic material for high frequencies consists essentially of a main component expressed by the general formula:

Magnetic material for high frequencies

A high-frequency use non-reciprocal circuit includes a sintered body which is a high-frequency use magnetic body obtained by a ceramic lamination/integral firing technique, a plurality of central electrodes which are arranged in the sintered body to be separated from each other through a magnetic layer while intersecting with each other at central portions, and electrodes for deriving impedance-matching capacitance which are formed in the vicinity of the intersecting portion to be in series with the central electrodes. The magnetic layer provided between the central electrodes serves as an insulating layer for electrically insulating the central electrodes from each other, a high-frequency use magnetic layer, and a material layer for deriving the impedance-matching capacitance.

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Otsu, Japan

Kunisaburo Tomono