Mitsubishi Materials Corporation

Samsung Sdi Co., Inc.

Kunio Sugamura

Yoshirou Kuromitsu

Yoshio Kanda

Seiji Toyoda

Hideaki Sakurai

Hideaki Yoshida

Toshiyuki Nagase

Masato Otsuki

Akira Nakabayashi

Masafumi Hatsushika

Eun Gi Heo

Young Soo Seo

Seung Jae Chung

Joon Min Kim

Ryuji Uesugi

Hyun Sub Lee

Young Cheul Kang

One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.

Blade with comb teeth coated with a compound layer for forming ribs and its production method

A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

Ceramic circuit board with heat sink

An aluminum nitride (AlN) substrate comprising an AIN sinter, an Al.sub.2 O.sub.3 layer provided on the sinter, and a glass-mixed Al.sub.2 O.sub.3 layer which is provided on the Al.sub.2 O.sub.3 layer and contains Al.sub.2 O.sub.3 and glass mixed therewith, preferably with an oxide particle-dispersed glass layer and a main glass layer provided on the glass-mixed Al.sub.2 O.sub.3 layer. The AlN substrate has heat dissipation properties closer to those of AlN itself, does not cause generation of air bubbles at the junction interface between the AlN sinter and the glass-containing layer, and has excellent surface smoothness and corrosion resistance. The very fine conductive layer, etc. may be readily and firmly formed on the substrate in a stable manner.

Aluminum nitride substrate and method of producing the same

A glazed AlN substrate includes: a sintered AlN body, a surface oxidized layer formed on the sintered AlN body, an Al.sub.2 O.sub.3 --SiO.sub.2 layer formed on top of the intermediate surface oxidized layer, and a glass layer formed on top of the Al.sub.2 O.sub.3 --SiO.sub.2 layer. In one embodiment, an additional SiO.sub.2 layer is interposed between the glass layer and the Al.sub.2 O.sub.3 --SiO.sub.2 layer. A method of producing the AlN substrate is also disclosed that permits firing of the glass layer at high temperatures.

Method of making glazed AlN substrate with an Al.sub.2 O.sub.3

Growing community of inventors

Omiya, Japan

Kunio Sugamura