Matsushita Electric Industrial Co., Ltd.

Kunio Sakurai

Minoru Yamamoto

Wataru Hirai

Kurayasu Hamasaki

Makito Seno

Youichi Nakamura

Ken Takano

Muneyoshi Fujiwara

Hiroshi Ota

Hirokazu Honkawa

Seiichi Mogi

Yoshihiko Misawa

Takahiro Yonezawa

Kazumasa Okumura

Yoshiyuki Nagai

Akiko Ida

Kentaro Nishiwaki

Akiko Katsui

Takeshi Okada

Naoto Hosotani

Hiroshi Ohta

Hirotsugu Uemori

Youichi Makino

Naohiko Chimura

The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Board transferring apparatus including identifying devices, and component mounting apparatus including the board transferring apparatus

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimensionL+SL. Specifically,L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Components placing apparatus

The present invention has for its object to provide a mechanism for preventing a liquid from splashing from a liquid tank, and a component mounting apparatus with this liquid splashing prevention mechanism. The liquid splash prevention mechanism has a first seal member with a circumferential outer face attached to a first driving lever in a lubricating oil tank, and a second seal member with an arc face set in the lubricating oil tank correspondingly to the first seal member so that a sealing gap for preventing lubricating oil from scattering is formed between the first seal member and the second seal member. Moreover, the lubricating oil is filled in the sealing gap. Scattering of the lubricating oil is more surely prevented by this arrangement. Quality degradation to be caused by adhesion of the lubricating oil to printed boards and the like can be prevented, and productivity can be improved.

Liquid splash preventing mechanism and component mounting apparatus

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel. Thus, the electronic components can be mounted onto the circuit board in a short process time.

Component mounting apparatus

Board transfer apparatus, board transfer method, and component mounting apparatus

A plurality of self-propelled system heads ( ) are made to independently travel along a closed-loop travel track ( ) in a manner that the heads do not interfere with each other by controlling respective drive devices ( ). Components ( ) from a component supply device ( ) are held by component holding members ( ) of the heads, and thereafter, the components held by the component holding members are mounted on boards ( ) positioned by board positioning devices ( ).

Method and apparatus for mounting component

Each of a plurality of suction nozzle sections provided about the outer circumference of an intermittently rotating head section comprises a plurality of nozzle tip sections for picking up electronic components by suction, these nozzle tip sections being connected to a rod section , which is driven to rotate by a motor . A cylindrical cam section having a cam surface and being able to rotate relative to the rod section is provided such as to encase the nozzle tip sections , and one ends of the nozzle tip sections engage with the cam surface 8a of the cam section via rollers , whereby the nozzle tip sections are movable in a vertical direction. On the outer side of the cylindrical cam section , a stopper section is provided for halting temporarily the rotation of only the cylindrical cam surface

Electronic component mounting apparatus

An electronic component mounting apparatus includes a plurality of pickup nozzles (,) which are attached to the periphery of a rotary table, that intermittently rotates. The apparatus also includes a cylindrical cam (,) having a cam groove (,) which allows the pickup nozzles (,) to move up and down. A first roller (,) is attached to a first slide portion (,), which is equipped with the pickup nozzles,. The first roller runs within the cam grooves (,) to make the pickup nozzles,move up and down. A second roller (,) is attached to a second slide portion,which is attached to the pickup nozzles (,). The second roller runs within the cam grooves (,) to make the pickup nozzles move up and down together with the first roller. Also, springs (,) are provided for biasing the first and second rollers (,) into contact with the two side surfaces, respectively, of the cam grooves (,).

Electronic part mounting device

Electronic component feeder

A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation. The mounting device also includes a pressure gas transmitting member having positive and negative pressure holes of gas passages formed at its inside, and a gas switching member having a gas groove communicating with a suction passage of a suction member for sucking the component. The switching member is movable to selectively switch between states where the suction passage is communicated with the positive pressure hole and the negative pressure hole, respectively.

Mounting apparatus of electronic component

A component placement machine for mounting, on a substrate placed in position by an XY-table, a first electronic component supplied from an electronic component-supply section, includes an electronic component-holding portion for holding the first electronic component and being vertically movable; and a device for setting a movement-prohibiting time period of the XY-table by calculating a period of time in which there is a possibility that the first electronic component and a second electronic component mounted on the substrate may interfere with each other, based on a height of the first electronic component and a maximum height of the second electronic component.

Growing community of inventors

Toyonaka, Japan

Kunio Sakurai