Other

Sulfur Chemical Laboratory Inc.

Meiko Electronics Co., Ltd.

Kabushiki Kaisha Toshiba

Toyota Jidosha Kabushiki Kaisha

Denso Corporation

Nippon Zeon Company, Ltd.

Iwate University

Asahi Rubber Inc.

Fuji Polymer Industries Co., Ltd.

Sulfur Chemical Institute Inc.

Mori, Kunio

Kunio Mori

Katsuhito Mori

Yusuke Matsuno

Takahiro Kudo

Shigeru Michiwaki

Manabu Miyawaki

Yoshio Mochida

Yoshiro Nakamura

Minoru Okumura

Matsuo Miyazaki

Yasuyuki Masuda

Hitomi Chiba

Kouichi Kamiyama

Masanori Yanai

Shuukichi Takii

Nobuo Suzuki

Takeshi Bessho

Makoto Takahashi

Kazuhisa Takagi

Kiyoshi Hosoya

Masami Saito

Hirotaka Miyano

Kazuhiro Morita

Taiga Handa

Nobumasa Kimura

Michiko Kume

Takayo Hamazaki

Sigeru Suzuki

Fusako Suzuki

Hisayo Minamide

Yusako Sakai

Keisuke Kawahama

Tomoyuki Okumura

A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.

Bonded structure

A measurement device for estimating thermal characteristics includes a heat generating source unit that has heat sensors for detecting heat radiating toward a measurement sample unit, and that heats the measurement sample unit, the measurement sample unit, and a heat cooling source unit that has heat sensors for detecting heat radiating from the measurement sample unit, and that cools the measurement sample unit, wherein those units are sequentially stacked, the measurement sample unit has a three-layer structure consisting of an object to be measured for estimating thermal characteristics, and heat conducting materials that sandwich the object, the heat conducting materials are adhered to the heat generating source unit and the heat cooling source unit one another through a heat-transfer promoting agent therebetween, the object to be measured for estimating thermal characteristics and the heat conducting materials are adhered to one another through physical contact, chemical contact, and/or chemical bond contact.

Measurement device for estimating thermal characteristics, and measurement method for estimating thermal characteristics by using same

A surface treatment agent including a compound (&#x3b1;) is provided. The compound (&#x3b1;) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Surface treatment agent and novel compound

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (&#x3b1;) to a substrate and thus providing compound (&#x3b1;) thereon, wherein: the compound (&#x3b1;) is at least one of Formula [IV] and Formula [V]: 

Surface treatment method, surface treatment agent, and novel compound

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (&#x3b1;) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (&#x3b1;) by a wet-mode plating technique, wherein the compound (&#x3b1;) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Process for forming metal film, and product equipped with metal film

To provide a technique by which an &#x2014;OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (&#x3b1;) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (&#x3b1;) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (&#x3b1;) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound

A base material for adhesion to be adhered to a solid body comprising;

Base material for adhesion and silicone rubber-adhered article using thereof

The triazine thiol derivative having a perfluoro group of the present invention is represented by the following chemical formula: ##STR1## in which 'n' is an integer of 1-12, 'R' is represented by the following general formula;

Triazine thiol derivative having a perfluoro group, method for producing

A three-dimensional parking facility which includes an upper parking portion and a lower parking portion. The three-dimensional parking facility further includes a device for swinging the upper parking portion and the lower parking portion. The swinging device is supported by a member running along a horizontal axis on a solid foundation.

Three-dimensional parking facility

A curable acrylic rubber composition which is comprised of (A) an acrylic polymer and, as a curing agent, a combination of (B) a polymer of a dibutylaminotriazine thiol with (C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10 -oxide or a reaction product thereof with a carbonyl compound. This rubber composition is not scorched at room temperature, but is cured at a high rate of reaction at a rubber curing temperature.

Curable acrylic rubber containing dibutylaminotriazine thiol and

A heat transfer promoter composition comprises a triazine-dithiol derivative represented by the general formula ##STR1## wherein R represents --NHR' or --NR'.sub.2 wherein: R' is a hydrocarbon group; M is selected from the group consisting of hydrogen, alkali metals, and alkaline earth metals; and at least one of M groups is alkaline metal or alkaline earth metal. This heat transfer promotor is applied to that surface of a condenser tube to be contacted by a vapor to be condensed.

Heat transfer promoters and method of using the same

Growing community of inventors

Morioka, Japan

Kunio Mori