Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Engineering Company, Limited

Kunio Kobayashi

Akihiro Washitani

Yasushi Ideta

Keiko Kaneko

Tsunenori Umetsu

Shinji Semba

Isamu Yamamoto

Jiro Takamura

Shinji Enoshima

Hiromichi Yamada

Shigeru Takada

Kiyoji Imanaka

Mitsuru Yamazaki

Isao Asaka

Kunihiro Shigetomo

Sekio Ito

Eiri Yuhara

Shinji Sogabe

Sekio Itoh

Hiroyuki Shinmen

There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Contact terminal element, contact terminal device

A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of semiconductor device placed thereon; a distributing stocker mechanism for placing the plurality of pallets in the magazine onto a carrier; a carrier transporting mechanism for transporting the carrier into a test station in a constant temperature room and transporting the carrier after to outside the constant temperature room; and a recovery stocker mechanism for recovering the plurality of pallets after test on the carrier into the magazine. Thus, the transporting apparatus with high installing area efficiency and high test efficiency can be fabricated at low production cost.

Transporting apparatus for semiconductor device

A semiconductor device socket prevents adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. A positioning base of the socket supports external leads of the semiconductor device such that the lead ends of the leads do not contact a body of the socket. Movable contact terminals of the socket disposed opposite the external leads can move into and out of contact with the external leads.

Semiconductor device socket

A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.

A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.

A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

Method of testing semiconductor device and test apparatus for the same

A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.

Process of raising a semiconductor device out of a pallet using a

Tape carrier, and test apparatus for the same

An apparatus for inspecting the appearance of a semiconductor device has an imaging device which forms an image of the outside of a semiconductor device. An image analyzer analyzes the image and determines whether the semiconductor device is good or bad. A semiconductor device to be inspected is removed from a first conveyor on the periphery of a turntable by a vacuum chuck which is mounted on the turntable, and the semiconductor device is transported to in front of the imaging device by a turntable. If the semiconductor device is determined to be good, the turntable transports the semiconductor device to a second conveyor on the periphery of the turntable, and the vacuum chuck deposits the semiconductor device on the second conveyor. If the semiconductor device is determined to be bad, the turntable transports the semiconductor device to a discard receiving mechanism on the periphery of the turntable, and the vacuum chuck deposits the semiconductor device on the discard receiving mechanism.

Growing community of inventors

Itami, Japan

Kunio Kobayashi