Shin-etsu Chemical Co., Ltd.

Other

Kunihiro Yamada

Kenichi Tsuji

Kenichi Isobe

Nobuaki Matsumoto

Takayuki Takahashi

Hiroaki Kizaki

Keita Kitazawa

Kunihiko Mita

Hiroaki Tetsuka

Kei Miyoshi

Akihiro Endo

Ikuo Sakurai

Shota Akiba

Satoshi Kuwata

Hiroshi Ohashi

Tsutomu Yoneyama

Akio Nakano

Nobuyuki Terae

Yoshitaka Aoki

Masaya Ueno

Syuichi Azechi

Osamu Uchida

Kazuhiro Toba

This thermally-conductive silicone composition contains specific proportions of

Thermally-conductive silicone composition

A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios:

Thermally conductive silicone composition and production method therefor

Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains:

Thermal conductive silicone composition and semiconductor device

Provided is a thermal conductive silicone composition containing:

Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor device

A thermosoftening and heat conductive silicone grease composition including: (A) a silicone wax having a melting point of 30-80&#xb0; C.; (B) a organopolysiloxane indicated by formulaRSiO(Rindicating a monovalent hydrocarbon group and a being 1.8&#x2264;a&#x2264;2.2) and having a kinematic viscosity of 10-500,000 mm/s at 25&#xb0; C.; and (C) a heat conductive filler material having a heat conductivity of at least 10 W/(m&#xb7;K).

Thermosoftening and heat conductive silicone grease composition, heat conductive film formation method, heat dissipation structure, and power module device

A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G&#x2033; of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G' after 3,000 seconds from the start of holding is 10,000 Pa or less, G&#x2032; after 7,200 seconds from the start of holding is 100,000 Pa or less, and G&#x2032; exceeds G&#x2033; after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.

Silicone composition and method for manufacturing heat-conductive silicone composition

A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G' being measured by constructing a program for holding a sample at 150&#xb0; C. for 7,200 seconds after the sample is heated from 25&#xb0; C. to 125&#xb0; C. at a temperature increase rate of 10&#xb0; C./min, from 125&#xb0; C. to 145&#xb0; C. at a temperature increase rate of 2&#xb0; C./min, and from 145&#xb0; C. to 150&#xb0; C. at a temperature increase rate of 0.5&#xb0; C./min.

Heat-conductive silicone composition

A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G&#x2033; of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G' after 3,000 seconds from the start of holding is 10,000 Pa or less, G&#x2032; after 7,200 seconds from the start of holding is 100,000 Pa or less, and G&#x2032; exceeds G&#x2033; after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.

Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains:

Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25&#xb0; C. of 10 to 100,000 mm/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m&#xb0; C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed.

Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device

Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (wherein Rrepresents a monovalent hydrocarbon group; Rrepresents an alkyl group, an alkoxyalkyl group, an alkenyl group or an acyl group; n represents 2 to 100; and a represents 1 to 3);

Thermally-curable heat-conductive silicone grease composition

The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (Ris a Calkyl group, and a is an integer 5 to 100);

Thermally conductive silicone grease composition

A curable organopolysiloxane composition in grease or paste form, which including: wherein Rmay be the same or different and represents a monovalent hydrocarbon group, Rrepresents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.

Curable organopolysiloxane composition and semiconductor device

A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa&#xb7;s at 25&#xb0; C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Heat-conductive silicone grease composition

A thermally conductive silicone grease composition comprising: wherein Rrepresents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100;

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Annaka, Japan

Kunihiro Yamada