Murata Manufacturing Co., Ltd.

Taiyo Yuden Co., Ltd.

Kunihiro Watanabe

Teruhisa Tsuru

Hiroshi Masuda

Yujiro Dakeya

Harufumi Mandai

Seiji Kanba

Tsuyoshi Suesada

Takeshi Yamamoto

Takeshi Kogure

Yusuke Tanaka

Kenji Tahara

Naohide Tomita

Seikoh Ono

Toru Meguro

Rumiko Yuasa

A multilayer substrate includes a via electrode defining and functioning as an end portion on ground terminals side of a first inductor connected to a shield electrode, the end portion on a signal line side is adjacent to or in a vicinity of a first principal surface than the end portion on the ground terminals side is in the lamination direction of base material layers, a via electrode defining and functioning as the end portion on the ground terminals side of a second inductor is connected to the shield electrode, and the end portion on the signal line side is adjacent to or in a vicinity of the first principal surface than the end portion on the ground terminals side is in the lamination direction of the base material layers.

Laminated LC filter

A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.

Radio-frequency signal transmitting and receiving circuit

An electronic component includes a multilayer body and a first resonator. The multilayer body includes insulating layers stacked on each other in a stacking direction. The first resonator includes a first inductor and a first capacitor disposed in the multilayer body. The first inductor is defined by a conductive layer disposed on an insulating layer of the plurality of insulating layers and an interlayer connecting conductor which passes through an insulating layer of the plurality of insulating layers in the stacking direction connected to each other so that the first inductor preferably has a helical or substantially helical shape as viewed from a first direction perpendicular or substantially perpendicular to the stacking direction. A certain portion of the first inductor is located on a predetermined plane perpendicular or substantially perpendicular to the first direction, and a remaining portion of the first inductor is displaced from the predetermined plane in the first direction.

Electronic component

An electronic component includes first through n-th inductors that turn around as viewed from a first direction perpendicular or substantially perpendicular to a stacking direction of a multilayer body of the electronic component. An (n+1)-th inductor includes a linear (n+1)-th inductor conductive layer which is provided in a configuration in which it turns around, as viewed from the stacking direction, and which is located within a region surrounded by the first inductor, as viewed from the first direction. An (n+1)-th capacitor is electrically connected to a first outer electrode, and includes an (n+1)-th capacitor conductive layer which opposes a first inductor conductive layer defining the first inductor with an insulating layer of a plurality of insulating layers of the multilayer body interposed therebetween.

A high frequency component includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, linear conductors extending along the insulating layers, interlayer connection conductors extending through at least one of the insulating layers, and planar conductors extending along the insulating layers. The high frequency component further includes transverse coils and internal capacitors. Each of the transverse coils includes the linear conductors and the interlayer connection conductors spirally wound in a plane in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction. Each of the internal capacitors includes the planar conductors being opposed to each other such that at least one of the insulating layers is disposed therebetween, the internal capacitor being arranged within a coil opening of the transverse coil when viewed along the winding axis of the transverse coil.

High frequency component and filter component

A high-frequency switch module includes a FET switch mounted on a multilayer substrate and a low pass filter arranged between the FET switch and a transmission signal input terminal. The low pass filter includes at least one inductor connected in series between a transmission input port and the transmission signal input terminal, a first capacitor, one end of which is connected to the transmission input port and the other end of which is grounded, and a second capacitor, one end of which is connected to the transmission signal input terminal and the other end of which is grounded, and the first capacitor and the second capacitor have different capacitance values.

High-frequency module

In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.

In a solid state imaging apparatus of the present invention, first and second charge-coupled devices (CCDs)A andB are prepared as two charge accumulation circuits for one photodiode. The first and second CCDsA andB additionally accumulate charges during an on-state and an off-state of a light emitting source in the imaging apparatus, respectively. After the additional charge accumulation, the additionally accumulated charges in the first and second CCDsA andB are fed to first and second charge transfer CCD registersA andB, respectively. The charges in the first and second charge transfer CCD registersA andB are shifted in sequence to thereby output first and second charge signals, respectively. A differential amplifierof the imaging apparatus calculates and outputs a differential signal between the first charge signal and the charge second signal. By using the imaging apparatus of the present invention, the effect, e.g., backlight and/or over exposure effect, due to background light inputted to the photodiodewith almost equal intensity during the on-state and the off-state thereof is removed to thereby obtain a clear image of a target subject formed corresponding to the radiation light from the light emitting source.

Solid state imaging device for alleviating the effect of background light and imaging apparatus including same

A portable terminal device including a main body including a data entry keyboard; a cover openably and closably attached to the main body and establishing a connecting portion between the main body and the cover; a display disposed on the inner side of the cover; a chip antenna disposed on the cover at a place other than the display and opposed to the connecting portion; the chip antenna including a ceramic base body, a conductor disposed at least either inside the base body or on a surface thereof, and a feeding terminal disposed on a surface of the base body and connected to one end of the conductor. The above portable terminal device has the directivity of an antenna in a desired direction without increasing the size and weight of the portable terminal device and without having a bulky and/or separate and/or protruding antenna device.

Portable terminal device with chip antenna

A chip antenna comprising a basic body made of a ceramic material; a first conductor and a second conductor respectively disposed at least either inside or on the surface of the basic body so as to be close to each other; a feeding terminal for applying a voltage to the first conductor disposed on the surface of the basic body and connected to the first conductor; and a grounding terminal disposed on the surface of the basic body and connected to the second conductor.

Growing community of inventors

Nagaokakyo, Japan

Kunihiro Watanabe