Tanaka Kikinzoku Kogyo K.k.

Chubu Electric Power Company, Inc.

Kyoto University

Tokushima University

Tanaka Kikinzoku Kogyo Kabushiki Kaisha

Kunihiro Shima

Shigeo Nagaya

Naoji Kashima

Kenji Goto

Hirofumi Hoshino

Yasushi Masahiro

Hiroo Iwata

Shuichi Kubota

Tomonobu Kodama

Asaka Ueno

Ryusuke Nakai

Tomonori Watanabe

Yuya Kato

Kojiro Shiraishi

Toshiya Yamamoto

Kunihiro Tanaka

Takeyuki Sagae

Osamu Sakaguchi

Michimasa Okubo

Kiyokazu Kojima

Kenichi Hamada

Eiichi Honda

Takeshi Fuse

Shinji Kouno

Ryosuke Suganuma

Shubham Yadav

Emi Takegawa

Shinsuke Mano

Yuya Saito

A probe pin material including a Ag&#x2014;Pd&#x2014;Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag&#x2014;Pd&#x2014;Cu-based alloy are required as follows: a Ag concentration (S), a Pd concentration (S) and a Cu concentration (S) converted as given that a Ag&#x2014;Pd&#x2014;Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag&#x2014;Pd&#x2014;Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

Probe pin material including Ag&#x2014;Pd&#x2014;Cu-based alloy

The present invention relates to an alloy for medical use, including Pt, Co, Cr, Ni, and Mo. The alloy includes 10 atom % or more and 30 atom % or less of Pt, 20 atom % or more and 31 atom % or less of Cr, 5 atom % or more and 24 atom % or less of Ni, 4 atom % or more and 8 atom % or less of Mo, the balance Co, and unavoidable impurities, and a ratio of the Ni content (C) to the Pt content (C), C/Cis 1.5 or less. The present invention can be applied to various kinds of devices for medical use, such as catheter, embolic coils, and guide wires, in addition to stents such as flow-diverter stents.

Pt&#x2014;Co based alloy for medical use

The present invention relates to a medical Au&#x2014;Pt&#x2014;Pd alloy including Au, Pt, Pd, and inevitable impurities. The alloy has an alloy composition inside a polygon (A1-A2-A3-A4-A5-A6) surrounded by straight lines connected at point A1 (Au: 37.9 atom %, Pt: 0.1 atom %, and Pd: 62 atom %), point A2 (Au: 79.9 atom %, Pt: 0.1 atom %, and Pd: 20 atom %), point A3 (Au: 79.9 atom %, Pt: 20 atom %, and Pd: 0.1 atom %), point A4 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), point A5 (Au: 49 atom %, Pt: 30 atom %, and Pd: 21 atom %), and point A6 (Au: 39 atom %, Pt: 40 atom %, and Pd: 21 atom %) in a Au&#x2014;Pt&#x2014;Pd ternary state diagram. The metal structure of the alloy is optimized, and the metal structure is close to a single-phase structure, and has little precipitation of a Au-rich phase and a Pt-rich phase different in composition from a mother phase.

Medical Au-Pt-Pd alloy

The present invention provides an alloy for medical use including an Au&#x2014;Pt alloy, in which the Au&#x2014;Pt alloy has a Pt concentration of 24 mass % or more and less than 34 mass % with the balance being Au, and has at least a material structure in which a Pt-rich phase having a Pt concentration higher than that of an &#x3b1;-phase is distributed in an &#x3b1;-phase matrix, the Pt-rich phase has a Pt concentration that is 1.2 to 3.8 times the Pt concentration of the &#x3b1;-phase, and the Pt-rich phase has an area ratio of 1 to 22% in any cross-section. This alloy is an artifact-free alloy material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of &#xb1;4 ppm with respect to magnetic susceptibility of water.

Alloy for medical use, and method for producing same

The present invention discloses a spark plug electrode material including a substrate formed of Ir or Ir alloy, and an antioxidant film covering a surface of the substrate. Here, an underlying layer formed of Au is formed on a surface of the substrate formed of Ir or Ir alloy, and on the underlying layer, a Ni film having a thickness of 3.0 &#x3bc;m or more and 8.0 &#x3bc;m or less is formed as an antioxidant film. The Ni film turns into an antioxidant film formed of Ni oxide in an oxidizing atmosphere at 500&#xb0; C. or higher. Owing to the antioxidant film, the spark plug electrode material of the present invention has an excellent high-temperature oxidation property.

Material for spark plug electrode and method for producing same

The present invention is an alloy for medical use including an Au&#x2014;Pt alloy, containing 34 to 36 mass % of Pt with the balance being Au, and having an &#x3b1;-phase single structure in which a ratio of a peak intensity (X) of a Pt (111) plane to a peak intensity (Y) of an Au (111) plane (X/Y) is 0.01 or less in an X-ray diffraction analysis. The alloy can be produced in such a manner that after the Au&#x2014;Pt alloy ingot is molten and cast, cold working and a heat treatment for homogenization are performed at least two times on the molten and cast alloy. The alloy of the present invention is an artifact-free material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of &#xb1;4 ppm with respect to that of water.

Alloy for medical use and method of producing the same

The present invention provides a textured substrate for forming an epitaxial film, including a textured metal layer on at least one surface of the layer, the textured metal layer including a copper layer having a cube texture, the textured metal layer having, on a surface of the layer, palladium added in an amount of 10 to 300 ng/mmper unit area, the hydrogen content of the surface of the textured metal layer being 700 to 2000 ppm. This textured substrate is produced through a step of adding 10 to 300 ng/mmper unit area of palladium by strike plating to a surface of the copper layer having a cube texture.

Textured substrate for forming epitaxial film and method for producing the same

The present invention relates to a textured substrate for epitaxial film formation, comprising a textured metal layer at least on one side, wherein the textured metal layer includes a copper layer having a cube texture and a nickel layer having a thickness of 100 to 20000 nm formed on the copper layer; the nickel layer has a nickel oxide layer formed on a surface thereof, having a thickness of 1 to 30 nm, and including a nickel oxide; and the nickel layer further includes a palladium-containing region formed of palladium-containing nickel at an interface with the nickel oxide layer. The top layer of the textured substrate, i.e. the nickel oxide layer, has a surface roughness of preferably 10 nm or less.

Textured substrate for epitaxial film formation, and method for manufacturing the same

The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The present invention provides a clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a silver layer bonded to at least one face of the metallic layer, wherein the silver layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;9 degree. The textured metal substrate can be manufactured by subjecting the silver sheet containing 30 to 200 ppm oxygen by concentration to the orienting treatment of hot-working and heat-treating, and bonding the metal sheet with the oriented silver sheet by using a surface activated bonding process.

Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. A clad textured metal substrate for forming the epitaxial thin film thereon according to the present invention comprises a metallic layer and a nickel layer which is bonded to at least one face of the metallic layer, wherein the nickel layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;7 degrees and has a nickel purity of 99.9% or more. The oriented metal substrate is manufactured by cold-working the nickel sheet having a purity of 99.9% or more, heat-treating it for orientation, and bonding the metal sheet with the oriented nickel sheet by using a surface activated bonding process.

A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;6 degree. The substrate has an intermediate layer on the surface of the copper layer, to form the epitaxial thin film thereon.

Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (&#x394;&#x3c6; and &#x394;&#x3c9;) in the textured metal layer surface and orientation degrees (&#x394;&#x3c6; and &#x394;&#x3c9;) in the crystal orientation improving layer surface are both 0.1 to 3.0&#xb0;. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved. At this time, the surface roughness of the substrate surface becomes 20 nm or less.

Textured substrate for epitaxial film formation and surface improving method of textured substrate for epitaxial film formation

A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.

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Gunma, Japan

Kunihiro Shima