Mitsubishi Paper Mills Limited

Kunihiro Nakagawa

Seiichi Sumi

Munetoshi Irisawa

Yuji Toyoda

Toshiro Kondo

Yoshikazu Takaya

Seigo Ebato

Kenichi Nishi

Katsuaki Iwaosa

Hiroshi Nishinoiri

Motozo Yamano

Susumu Baba

Hideaki Baba

Yasuo Kaneda

Motoshige Yamada

Noriyuki Kawai

Kunihito Kajiya

Yoshihiro Kagawa

Norihiko Gokan

Tosihiko Netsuko

Shoji Akaiwa

Masato Higashiyama

Yoshiya Takahashi

The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.

Photosensitive resin composition and etching process

A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a') forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b&#x2032;) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.

Method for electroconductive pattern formation

Photomask material and method of processing thereof

There is disclosed an aluminum lithographic printing plate material which comprises an aluminum substrate, a silver halide emulsion layer and a physical development nuclei layer between the aluminum substrate and the silver halide emulsion layer, said silver halide emulsion layer contains photographic gelatin and gelatin having a weight average molecular weight of about 50,000 or less is contained in said silver halide emulsion layer and/or under said layer.

Lithographic printing plate material

Disclosed is a silver halide photographic photosensitive material comprising a support and, provided thereon, at least one hydrophilic colloid layer including a photosensitive layer wherein the photosensitive layer comprises monodispersed silver halide grains having an average grain size of 0.2 micron or less and comprising at least 90 mol % of silver chloride, the photosensitive layer or a hydrophilic colloid layer provided on the same side of the support as the side on which the photosensitive layer is provided contains a hydrazine derivative, a hydrophilic colloid layer provided above the photosensitive layer contains a water-dispersible fine particle polymer, the photosensitive layer contains substantially no water-dispersible fine particle polymer, and amount of the water-dispersible fine particle polymer contained in the hydrophilic colloid layer is 1 g/m.sup.2 or less and is 5% by weight or more based on the weight of gelatin contained in the hydrophilic colloid layer.

Silver halide photographic photosensitive material

The present invention provides a silver halide photographic photosensitive material which comprises a transparent support and a silver halide emulsion photosensitive layer provided thereon and a non-photosensitive layer on another side of the support on which the photosensitive layer is not provided, wherein both the photosensitive layer and the non-photosensitive layer contain dyes respectively and transmission density at 350-400 nm of the dye in the photosensitive layer is 0.15 or less and transmission density at 350-400 nm of the dye in the non-photosensitive layer is 0.40 or more.

Disclosed is a silver halide photographic light sensitive material which has a silver halide emulsion layer optically sensitized with a sensitizing dye having a maximum spectral sensitivity in the region of at least 700 nm, said emulsion layer containing at least one compound represented by the following formula (I) or at least one compound represented by the general formula (I) and at least one compound represented by the general formula (II) in combination: ##STR1## (wherein R.sub.1 and R.sub.2 each represents a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkenyl group, an amino group, an acylamido group or a sulfonamido group and sum of carbon atom numbers of R.sub.1 and R.sub.2 is 3 or more.); ##STR2## (wherein R.sub.3 represents an alkyl group of at least 3 carbon atoms or an aryl group).

Silver halide photographic light sensitive material

Growing community of inventors

Tokyo, Japan

Kunihiro Nakagawa