Murata Manufacturing Co., Ltd.

Kunihiro Miyahara

Issei Yamamoto

Yutaka Masuda

Yoshihito Otsubo

Shoji Nagumo

Noboru Shiokawa

Yosuke Matsushita

Kanta Motoki

An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.

Electronic component

An electronic component includes an upper surface, a lower surface, a side surface, a circuit pattern, and an upper surface shield electrode. The circuit pattern is provided inside the electronic component. The upper surface shield electrode is disposed on the upper surface. In a plan view from a normal direction of the upper surface, a center of gravity of the upper surface shield electrode is spaced from a center of gravity of the upper surface.

Electronic component including shield electrodes

Provided is a stacked electronic component having: a stacked bodyin which ceramic layerstoare stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portionformed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodesformed between the layers of the stacked body; and a shield layerformed on the upper surface U and the side surfaces S of the stacked body. Right below an inner bottom surface of the recess portionof the stacked body, there is provided a no-electrode region NE in which the electrodesare not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion

Stacked electronic component and method for manufacturing stacked electronic component

A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.

Laminated electronic component and method of manufacturing the same

An electronic component includes a multilayer body including insulator layers laminated in a lamination direction, a side surface electrode provided on a side surface defined by contiguous outer edges of the insulator layers, and connected to a ground potential, at least one conductor layer provided on the insulator layers, a shield conductor layer provided on the insulator layer that is different from the insulator layer on which the inner conductor layer is provided, and overlapping with the inner conductor layer when viewed from the lamination direction, a first lead conductor layer provided on the insulator layer that is different from the insulator layer on which the shield conductor layer is provided, and connected to the side surface electrode, and a first interlayer connection conductor passing through least one of the insulator layers in the lamination direction to connect the shield conductor layer and the first lead conductor layer.

An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.

Electronic component including outer electrodes and a shield electrode

A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is larger than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is larger than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.

Multilayer electronic component

A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is smaller than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is smaller than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.

An electronic component includes dielectric layers laminated along a lamination direction and shield electrodes. The dielectric layers include first and second dielectric layers. The side surfaces of the first dielectric layer are not covered with the shield electrodes. The side surfaces of the second dielectric layer are covered with the shield electrodes. The dielectric constant of the first dielectric layer is lower than the second dielectric constant of the dielectric layer.

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Nagaokakyo, Japan

Kunihiro Miyahara