Rohm Co., Ltd.

Kunihiro Komiya

Atsushi Kitagawa

Hiroshi Sawada

Osamu Yanagida

Taisuke Chida

Tadayuki Sakamoto

Hiroaki Asazu

Kenta Konishi

Daisuke Shikuma

Takeya Shigezumi

The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.

Semiconductor device having electrode pads arranged between groups of external electrodes

The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.

A sensor system includes: a radio transmitting device transmitting a predetermined radio signal regularly; a sensor detecting opening/closing or locking/unlocking of a partition mechanism installed in a door of a building or a site; and an information processing device. The information processing device includes: a radio receiving part receiving the predetermined radio signal and result of detection of the sensor; a decision part deciding whether or not a person exists in the building or the site, based on the radio signal; a determination part determining the decision on existence of the person every trigger timing being a timing defined based on the result of the detection of the sensor; an information generation part generating information related to the behavior of the person based on the decision on existence of the person determined at the trigger timing; and an information output part outputting the information generated by the information generation part.

Sensor system

A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.

Semiconductor device comprising power elements in juxtaposition order

Semiconductor device

Semiconductor device having multiple external electrodes

A load driving device according to the present invention is provided with: an enabling control section generating an enabling signal from an externally inputted PWM signal; and a load driving section that is turned on/off according to the enabling signal, and that PWM-drives the load according to the PWM signal.

Load driving device, illumination device, display device

The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps are arranged in two rows along the periphery of the semiconductor device. The electrode pads are arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring is extended from an electrode pad, and is connected to any one of the outermost solder bumps or any one of the inner solder bumps.

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Multiple LED terminals are provided to multiple LEDs, respectively. Each of these LED terminals is connected to the anode of the corresponding LED. A booster circuit boosts an input voltage. Multiple constant current sources are provided to the multiple LEDs, respectively. One terminal of each of the constant current sources is connected to the corresponding one of the LEDs via the corresponding one of the LED terminals. Multiple switches are provided to the multiple constant current sources, respectively, each of which selectively outputs a voltage selected from the input voltage and the output voltage of the booster circuit to the corresponding constant current source. A control circuit monitors each of the voltages at the multiple LED terminals, and controls the connection state of each of the switches based upon the corresponding voltage.

Driving circuit for light emitting elements

A semiconductor device having a wafer level chip size package may include a semiconductor substrate having an integrated circuit formed thereon; a plurality of electrode pads formed on the semiconductor substrate; at least one rewiring layer which may include rewiring formed adjacent to the plurality of electrode pads; and a plurality of external electrodes formed on the rewiring layer. The plurality of electrodes and plurality of external electrodes may be sectioned and arranged in four areas having the same shapes. Each area may include a first group of N number of external electrodes arranged along an edge of the semiconductor substrate, a second group of (N-2) number of external electrodes arranged inside the first group of external electrodes, and a plurality of (2N-2) number of electrode pads arranged between the first and second groups of external electrodes.

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Kyoto, Japan

Kunihiro Komiya