Nichia Corporation

Kunihiro Izuno

Shinsuke Sofue

Yoshifumi Nagai

Yuichi Fujiwara

Hiroto Tamaki

Tsuyoshi Okahisa

Tadao Hayashi

Suguru Beppu

Teruhito Azuma

Masahiko Sano

Shinichi Nagahama

Keiji Sakamoto

Tomoya Yanamoto

Kouki Matsumoto

Motokazu Yamada

Junji Takeichi

Mototaka Inobe

A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device

A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.

A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.

Light emitting device

The present invention provides a reliable, long-life phosphor, or the like, which is prevented from darkening due to aging. A light emitting apparatus has a light emitting element and a phosphor layer. The phosphor layer has a phosphor excited by light from the light emitting element, and a binder which binds the phosphor. The binder is hydroxide oxide gel obtained by curing sol of a hydroxide oxide mixed with sol containing at least one metallic element selected from the group consisting of Al, Y, Gd, Lu, Sc, Ga, In, and B. Transmittance of hydroxide oxide in a gel state is higher than the transmittance in the polycrystal state where the sol-gel reaction is proceeded. In addition, the content of hydroxyl group or water of crystallization in the hydroxide oxide is 10% or less by weight.

Light emitting film, luminescent device, method for manufacturing light emitting film and method for manufacturing luminescent device

The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a method for easily manufacturing the semiconductor device. A semiconductor light emitting elementthat emits blue light is mounted face down on the top face of a pedestal, and a coating filmcontaining a YAG fluorescent materialthat emits yellow light is placed so as to cover the top face and side face of the semiconductor light emitting elementand the top face of the pedestal. With the semiconductor light emitting elementand other elements placed between a first filmand a second film, the films are laminated in vacuum, thereby to fasten the coating filmonto the semiconductor light emitting element. Then the first filmand the second filmare removed, the coating filmis trimmed and the pedestalis diced, thereby to obtain the semiconductor devicehaving the coating filmof a predetermined thickness provided along the circumference of the semiconductor light emitting element

Semiconductor device and method for manufacturing the same

A light emitting device, including a light emitting element, and a resin layer that has been screen printed to coat said light emitting element is provided. The resin layer is formed from a curable silicone resin composition, which includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5&#xd7;10, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. The uniformity of the film thickness is excellent, thus resulting in little color irregularities during light emission from the light emitting element.

Light emitting device with silicone resin layer formed by screen printing

A light emitting device is provided, including a light emitting element, a package comprised at least partially of metal on which said light emitting element is mounted, and a resin layer coated on said light emitting element. The light emitting element is eutectic bonded to a metal portion of said package, and the resin layer is formed of a cured product of a silicone composition. The composition includes (i) an organopolysiloxane having an average composition formula (1):R(OX)SiO&#x2003;&#x2003;(1)wherein Ris an alkyl, alkenyl or aryl group, X is a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group, a is a number from 1.05 to 1.5, b is a number of 0&#x3c;b&#x3c;2, and 1.05&#x3c;a+b&#x3c;2, and (ii) a condensation catalyst. The device exhibits improved heat resistance and light resistance, and also exhibits improved adhesion to the resins and metal members used.

Light emitting device with excellent heat resistance and light resistance

A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has a light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer including a light scattering material is provided at least over the first layer, and the surface of the second layer has a plurality of protrusions which follow the topology of the light scattering material. The display apparatus is formed by disposing these light emitting devices in an array on a substrate.

Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

A light emitting apparatus comprising a light emitting device () disposed on a supporting body (), and coating layers (() that bind a fluorescent substance that absorbs light emitted by the light emitting device () and emits light of a different wavelength and secures the fluorescent substance onto the surface of the light emitting device (). The coating layers () are made of an inorganic material including an oxide and a hydroxide, each containing at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals. Also an adhesive layer () is made of the same inorganic material as that of the coating layers ().

Light emitting apparatus and method of manufacturing the same

A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has a light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer includng a light scattering material is provided at least over the first layer, andthe surface of the second layer has a plurality of protrusions which follow the topology of the light scattering material. The display apparatus is formed by disposing these light emitting devices in an array on a substrate.

A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has (a) light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer including a light scattering material is provided at least over the first layer, and the surface of second layer has a plurality of protrusions which follow the topology of the light scattering material. The display apparatus is formed by disposing these light emitting devices in an array on a substrate.

A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has (a) light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer including a light scattering material Is provided at least over the first layer, and the surface of second layer has a plurality of protrusions which follow the topology of the light scattering material. The display apparatus is formed by disposing these light emitting devices In an array on a substrate.

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Anan, Japan

Kunihiro Izuno