Japan Synthetic Rubber Co., Ltd.

Nissan Motor Company Limited

The Japan Steel Works, Ltd.

Kunihiro Harada

Yoshiyuki Harita

Yoichi Kamoshida

Yoshihiro Hosaka

Kenji Yasuda

Shuichi Matsumoto

Toshiaki Yoshihara

Yasuaki Yokoyama

Koei Komatsu

Kiyoshi Kasai

Masashige Takatori

Norimasa Oda

Daizo Fukuma

Seiji Aotani

Eijiro Tagami

Yoshiki Maki

Masayuki Endoh

Kensho Shirota

Shigeru Suzuki

Mitsuo Kurokawa

Hideyuki Hanaoka

Mituru Tashiro

Akio Itabashi

An ionizing radiation sensitive resist consisting essentially of a polymer having a recurring unit represented by the following formula: ##STR1## wherein X is a hydrogen atom, a methyl group, or a halogen atom and R.sup.1, R.sup.2, R.sup.3, R.sup.4 and R.sup.5, which may be identical or different, are hydrogen atoms, halogen atoms, alkyl groups having 1 to 3 carbon atoms, alkoxy groups having 1 to 3 carbon atoms, haloalkyl groups having 1 to 3 carbon atoms or haloalkoxy groups having 1 to 3 carbon atoms, at least a part of the X groups present in said polymer being a halogen atom, at least a part of the Y.sup.1 and Y.sup.2 group present in said polymer being a halogen atom, and at least a part of the R.sup.1, R.sup.2, R.sup.3, R.sup.4 and R.sup.5 groups present in said polymer being a haloalkyl or haloalkoxy group having 1 to 3 carbon atoms. Said ionizing radiation sensitive resist is suitable as a negative type resist. This resist is used in the form of an organic solvent solution to form a coating film on a substrate and the desired parts of this coating film are irradiated with an ionizing radiation, whereby patterns are formed.

Process for forming patterns using ionizing radiation sensitive resist

A positive type photosensitive resin composition comprising an alkali-soluble novolac resin and (A) a compound represented by the following general formula (I) and a compound represented by the following general formula (II) or (B) a compound represented by the following general formula (III) and a compound represented by the following general formula (IV), wherein the molar ratio of the compound represented by the general formula (I) to the compound represented by the general formula (II) is 6/4-9/1 or the molar ratio of the compound represented by the general formula (III) to the compound represented by the general formula (IV) is 1/9-9/1 and the total amount of the component (A) or (B) is 5-100 parts by weight per 100 parts by weight of the alkali-soluble novolac resin: ##STR1## wherein R.sub.1, R.sub.5, R.sub.8 and R.sub.10, which may be identical or different, represent alkyl groups, aryl groups or aralkyl groups; and R.sub.2, R.sub.3, R.sub.4, R.sub.6, R.sub.7, R.sub.9, R.sub.11 and R.sub.12, which may be identical or different, represent 1,2-naphthoquinonediazide-4-sulfonyl groups, 1,2-naphthoquinonediazide-5-sulfonyl groups or 1,2-benzoquinonediazide-4-sulfonyl groups. Said positive type photosensitive resin composition is excellent in both sensitivity and yield of residual film thickness.

Positive type photosensitive resin composition with at least two

An epoxidized polyether, characterized by containing oxytetramethylene units and having in one molecule 0.9 or more epoxy groups on the average represented by the general formula (I): ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are hydrogen atoms or alkyl groups. An epoxy resin obtained from said epoxidized polyether alone or in admixture with an ordinary epoxy compound has a high flexibility.

Epoxidized polyether and process for producing the same

By adding a compound represented by the following general formulas: ##STR1## to a conventional photoresist composition comprising a cyclized product of conjugated diene homopolymer or copolymer and a photo-crosslinking agent soluble in an organic solvent, an image having a high degree of resolution can be obtained even when a base board having a surface of a high reflectance is used, with a high reproducibility and without being affected by prebaking conditions.

Photoresist composition

A photosensitive resin composition comprising a 1,2-quanonediazide compound and a copolymer consisting essentially of (A) a conjugated diolefinic compound, (B) a monoolefinically unsaturated compound and (C) an .alpha.,.beta.-ethylenically unsaturated carboxylic acid. Said composition can provide a positive type resist which is difficult to break and excellent in adhesion to a substrate.

Positive type photosensitive resin composition

Binders for polydiene composite propellants

In the process for preparing polyether glycol comprising (A) polymerizing tetrahydrofuran or a mixture of tetrahydrofuran and other copolymerizable cyclic ether(s) in the presence of a ring-opening polymerization catalyst comprising fuming sulfuric acid and/or fluorosulfuric acid as principal component, (B) adding water or an aqueous alkali solution to the polymerization product, and heating said reaction product under the strongly acidic condition to hydrolyze the same and (C) washing the hydrolysis product comprising polytetramethylene glycol and polyether glycol having oxytetramethylene groups as principal constituent, the polymerization of the tetrahydrofuran or the mixture of tetrahydrofuran and other copolymerizable cyclic ether(s) in the (A) step is carried out by (1) contacting the same with a ring-opening polymerization catalyst at a temperature within the range of -30.degree. C. to 10.degree. C. in the first stage, and (2) elevating the reaction temperature, when the conversion of said monomer into the polymer has reached 5% or more, to a temperature which falls within the range of 0.degree. C. to 40.degree. C. and is at least 10.degree. C. higher than the reaction temperature in the first stage and continuing the polymerization at this temperature. This process enables the effective and easy preparation of a highly functional polyether glycol having a relatively low molecular weight of about 500 to 5,000 and comprising oxytetramethylene groups as principal constituent, said polyether glycol being useful as a starting material for the preparation of polyurethanes, elastomeric polyesters, elastomeric polyamides and the like.

Process for the preparation of polyether glycol

By adding a compound represented by the following general formulas: ##STR1## to a conventional photoresist composition comprising a cyclized product of conjugated diene polymer or copolymer and a photo-crosslinking agent soluble in an organic solvent, an image having a high degree of resolution and only a small number of pinholes can be obtained even when a base board having a surface of a high reflectance is used.

When rubber is melted and decomposed in a screw extruder, a rubber melt can be produced without using a heavy oil with minimized evolution of gas by controlling the extruder cylinder temperature in the decomposing section of the screw within the range of 400.degree.-500.degree. C. and cooling the melt in the discharging section of the screw to a temperature of not more than 250.degree. C. The screw extruder suited for practising this method comprises a screw having a feeding section, a compressing section, a decomposing section and a discharging section which are arranged in that order from the inlet side, and a cylinder assembly consisting of a heating cylinder and a cooling cylinder arranged in that order from the inlet side, said feeding, compressing and decomposing sections of the screw being located corresponding to said heating cylinder, and said discharging section of the screw being located corresponding to said cooling cylinder.

Method for producing a rubber melt in a temperature-controlled screw

A photosensitive resin film consisting of a monolayer film of a composition comprising (a) a cyclized product of butadiene polymer, (b) at least one member selected from the group consisting of a photo-crosslinking agent, a photo-sensitizer and a photo-polymerization initiator, and (c) a storage stabilizer, and if necessary, a dye and/or a pigment, or a laminate structure photosensitive resin film prepared by laminating to the above photosensitive resin film a composition comprising (d) 100 parts by weight of a polymer or copolymer of monoolefinically unsaturated compound, (e) 5 to 100 parts by weight of a polyfunctional, photo-polymerizable, unsaturated compound having at least two photo-polymerizable double bonds in the molecule, (f) at least one member selected from the group consisting of a photo-crosslinking agent, a photo-sensitizer and a photo-polymerization initiator, and (g) a storage stabilizer, and if necessary, a dye and/or a pigment. Said photosensitive resin film can be intimately contacted with a negative film, and therefore, a sharp image can be obtained by exposing the resulting laminate to light through the negative film and then developing it. Said photo-sensitive resin film can also be laminated to a solid surface without entrapping any air even if the solid surface has irregularities. When the film has been exposed to light and developed, there is obtained a film excellent in heat resistance.

Laminate of monolayer film of cyclized butadiene polymer and other

A photoresist composition comprising a cyclized product obtained by contacting a conjugated diene polymer or copolymer having unsaturations in the main chain or side chains with a fluorine-containing substituted sulfonic acid compound represented by the formula:

Photoresist composition containing modified cyclized diene polymers

A photosensitive resin composition comprising (I) a copolymer containing (A) 10 to 95 mol % of a conjugated diolefinic hydrocarbon, (B) 5 to 90 mol % of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid and (C) 0 to 85 mol % of a monoolefinically unsaturated compound, (II) a photosensitizer and/or a photosensitive crosslinking agent, and, if necessary, (III) a photopolymerizable unsaturated monomer. Said copolymer may have been reacted with an inorganic alkali, an alkali salt or an amine compound in a proportion of 0.05 to 1.0 equivalent per equivalent of the carboxyl group of the .alpha.,.beta.-ethylenically unsaturated carboxylic acid in said copolymer. This photosensitive resin composition is excellent in storage stability, quick in photosetting upon exposure to actinic light rays including ultraviolet rays, that is, high in sensitivity, capable of development with water or a dilute aqueous alkaline solution and possesses satisfactory rubber elasticity, and a printing plate formed from the composition is excellent in water resistance though the composition is developable with an aqueous developing solution, so that the composition can be used for a flexographic printing plate, to which an aqueous flexographic printing ink can be applied. Said composition can also be used for a pohote-resist which is high in sensitivity, developable with water or a dilute alkaline solution and excellent in resolving power.

Photosensitive compositions and printing plates containing same

A stripping liquor composition consisting essentially of (A) at least one compound selected from among sulfonic acids, acid esters of sulfuric acid, and acid esters of phosphoric acid, (B) hydrogen peroxide, and (C) at least one of organic solvents, with or without the addition of (D) at least one of polyhydric alcohols.

Stripping liquor composition for removing photoresists comprising

A gypsum composition obtained by molding and drying an aqueous slurry comprising calcined gypsum, polyvinyl alcohol, and at least one metal compound. The composition has high surface hardness and high water resistance.

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Machida, Japan

Kunihiro Harada