Matsushita Electric Industrial Co., Ltd.

Kunihiro Fujii

Kozo Murakami

Satoshi Matsuo

Takafumi Koga

Masahiro Takada

Shigeru Tsuzuki

Kouzou Murakami

Hiroki Sato

Keiji Onishi

Yoshihiro Bessho

Kentaro Setsune

Katsunori Moritoki

Akihisa Yoshida

Michio Okajima

Mitihiko Takase

Akihiro Nanba

An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

Electronic component and method for manufacturing the same

A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.

Surface acoustic wave device and method for producing the same

A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.

Method of manufacturing a surface acoustic wave device

An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference . At the bottom of the package is a shield electrode , on which a chip is mounted via an adhesion layer . The chip and the internal contact electrode are electrically connected by an interconnection wire . Location aligning for the chip and the interconnection wire , at least either one of these, is conducted by making use of a region , which is non-electrode portion, provided on the inner bottom surface of the package

A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.

Surface acoustic wave device, method for producing the same, and circuit module using the same

An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.

Electronic component and electronic equipment using the same

A SAW element ( ) is formed of a piezoelectric substrate ( ), on which are provided IDT electrodes ( ), connection electrodes ( ), underlying metal layers ( ), and acoustic materials ( ) placed on the underlying metal layers ( ) and having surfaces parallel to the main surface of the piezoelectric substrate ( ). The SAW element is mounted in a package ( ), which is provided with external terminals ( ) connected with the connection electrodes ( ), and the package is hermetically sealed with a lid ( ) to form a SAW device. When such a SAW element ( ) is mounted faceup in a package ( ) using a vacuum chuck ( ), its piezoelectric substrate ( ) can be protected against damage. When a SAW element ( ) provided with bumps ( ) on its connection electrodes ( ) is mounted facedown in a package ( ), the failure of electrical connections can be prevented.

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Osaka, Japan

Kunihiro Fujii