Hitachi, Ltd.

Hitachi Device Engineering Co., Ltd.

Other

Hitachi Ulsi Systems Co., Ltd.

Hitachi Device Eng.

Kunihiko Yamaguchi

Kazuo Kanetani

Hiroaki Nambu

Keiichi Higeta

Noriyuki Homma

Goro Kitsukawa

Youji Idei

Noriyuki Honma

Hisayuki Higuchi

Takeshi Kusunoki

Yoshiaki Sakurai

Kaname Yamasaki

Kenichi Ohhata

Fumihiko Arakawa

Takao Watanabe

Atsushi Shimizu

Ryoichi Hori

Masanori Odaka

Satoru Isomura

Tohru Kobayashi

Yuko Ito

Takeo Yamada

Kengo Miyazawa

Kenichi Ohata

Hiroaki Nanbu

Kiyoo Itoh

Masahiro Iwamura

Takeo Shiba

Jun Etoh

Noriyuki Sakuma

Ikuro Masuda

Isao Yoshida

Tohru Nakamura

Katsumi Ogiue

Toru Masuda

Akihisa Uchida

Kiichiro Mukai

Nobuo Tamba

Masayuki Ohayashi

Toshiro Hiramoto

Yasuhiro Fujimura

Yasushiro Nishioka

Hiroshi Shinriki

Kiyoo Ito

Kayoko Saito

Ichiro Mitamura

Ken'ichi Ohata

Etsuko Kawaguchi

Kazuhiko Tani

Motoaki Matumoto

To speed up the operation of a decoder circuit, reduce the power consumption of the decoder circuit and increase the cycle, each circuit such as a buffer, a predecoder and a main decoder in the decoder circuit includes a semiconductor logic circuit in which the number of columns of transistors for pulling down at an output node is small, even if the number of inputs is many and the true and a complementary output signal having approximately the same delay time are acquired and the output pulse length of each circuit in the decoder circuit is reduced. With this arrangement, the operation of the decoder circuit can be sped up, the power consumption can be reduced, the cycles can be increased and, in a semiconductor memory, for example, access time and power consumption can be reduced and the cycles can be increased.

Semiconductor integrated circuit and semiconductor logic circuit used in the integrated circuit

To speed up the operation of a decoder circuit, reduce the power consumption of the decoder circuit and increase the cycle, each circuit such as a buffer, a predecoder and a main decoder in the decoder circuit include a semiconductor logic circuit wherein the number of columns of transistors for pulling down an output node is small even if the number of inputs is large, and the true output signal and a complementary output signal having approximately the same delay time are acquired and the output pulse length of each circuit in the decoder circuit is reduced. By virtue of this arrangement, the operation of the decoder circuit can be sped up, the power consumption can be reduced, the cycles can be increased and, in a semiconductor memory, for example, the reduction of access time and power consumption and the increase of the cycles are enabled.

A memory portion and a logic circuit portion of a semiconductor device are formed on a single semiconductor substrate in which a first logic circuit block and a second logic circuit block are formed in different areas and the second logic circuit is located between a pair of memory blocks. Data stored in the pair of memory blocks are transmitted to the second logic circuit block for processing via a memory peripheral circuit. A result of the data processing is transmitted to the first logic circuit block or an external device via an input/output circuit provided in the second logic circuit block. A clock signal entered at the center portion of the semiconductor chip is supplied to a plurality of first state clock distributing circuits equidistantly disposed from the center portion and then to a plurality of second stage clock distributing circuits at least equidistantly disposed from each of the first state clock distributing circuits. Next, the clock signal is supplied to a plurality of third state clock distributing circuits equidistantly disposed from each of the second stage clock distributing circuits and then supplied to a plurality of final stage clock distributing circuits equidistantly disposed from each of the third stage clock distributing circuits. From these final stage clock distributing circuits, the clock signal is supplied to an area in whose units an internal gate array and a RAM macro cell or a logic macro cell are made replaceable with each other.

Semiconductor integrated circuit device and method of manufacturing the

A semiconductor integrated circuit device having a memory portion and a logic circuit portion formed with a same semiconductor substrate comprising a first logic circuit block, a second logic circuit block disposed in an area different from an area in which the first logic circuit block is disposed, and a pair of memory blocks oppositely disposed so that the second logic circuit block comes in between. Data stored in the pair of memory blocks are transmitted to the second logic circuit block for processing via a memory peripheral circuit provided on the second logic circuit block. A result of the data processing is transmitted to the first logic circuit block or an external device via an input/output circuit provided in the second logic circuit block.

Semiconductor integrated circuit device with interleaved memory and

A dynamic random access memory device is provided having a dynamic memory cell, a word line coupled to the dynamic memory cell, a data line coupled to the dynamic memory cell, a precharge circuit coupled to the data line, a word driver coupled to the word line and a decoder coupled to the word driver. A plurality of address lines coupled to the decoder. The decoder has a first logic circuit whose inputs are connected to the plurality of address lines. The decoder also has a latch circuit whose input is connected to an output of the first logic circuit and whose output is connected to the word line.

Dynamic random access memory having bipolar and C-MOS transistor

A dynamic random access memory is provided which includes word lines for accessing memory cells, data lines for transferring information from the memory cells, and rewrite amplifiers connected to the data lines for rewriting the information to corresponding memory cells. Read pre-amplifiers are also provided for sensing the information, together with common data lines for transferring output signals of the read pre-amplifiers. Each of the read pre-amplifiers has two insulated gate field-effect transistors, gates of which are connected to the data lines, and sources/drains of which are connected with the common data lines, such that the common data lines do not form current paths with the data lines. In addition, the read pre-amplifiers are activated before the rewrite amplifiers.

Dynamic random access memory including read preamplifiers activated

Read signals to be outputted in the unit of bits from a packaged RAM are received to produce complementary output signals, and these output signals and the non-inverted and inverted signals of expected values are individually inputted to two logic circuits, so that the outputs of the logic circuits are compared by a coincidence/incoincidence circuit to produce a decision output.

Semiconductor integrated circuit device

Disclosed is a static type memory cell with high immunity from alpha ray-induced soft errors. The memory cell has a coupling capacitance C.sub.c between two data storage nodes 1 and 2. The p-well (or p-substrate) in which the driver-MOS transistors MN3, MN4 and the transfer MOS transistors MN1, MN2 are formed is connected to a V.sub.bb generator. The voltage V.sub.bb is set lower than the low level V.sub.L of the memory cell signal potential. Even when the potential variation .DELTA.V.sub.L of the low-voltage side node 2 is large, the parasitic diode present between the n-type diffusion layer corresponding to the source or drain of MN1-MN4 and the p-well (or p-substrate) does not turn on. Erroneous operations can therefore be prevented.

Memory cell and a memory device having reduced soft error

A circuit technique suitable to attain a high speed of a memory which is constructed in a manner such that memory cells include a field effect transistor and peripheral circuits include a bipolar transistor and a field effect transistor. According to the invention, a bipolar transistor whose collector is connected to a differential amplifier and which supplies a current to the differential amplifier in accordance with a signal which is inputted to a base or an emitter is added, and a bipolar transistor to supply a current only when writing to bit lines is connected. According to the invention, a high speed of the access time when information is read out by switching the selection bit line is accomplished. Further, the charge/discharge time of the bit line when information is written is reduced and a high speed of the writing time can be also accomplished. The improvement of the drivers of word lines and bit lines is also disclosed and a semiconductor memory which can operate at a high speed as a whole semiconductor memory can be realized.

Bit-line drive circuit for a semiconductor memory

A semiconductor integrated circuit device including a level conversion circuit in which the simplifying of the circuit and the increasing of the speed of operation have been attained is provided. A pair of complementary output signals amplified to a required signal level by a current switch circuit including differential transistors which receive an input signal and a reference voltage are inputted into a pair of emitter follower circuits. An emitter follower output transistor is driven by an output signal from one emitter follower circuit, while an N-channel MOSFET provided between the output transistor and a current source used as a load is driven by an output signal from the other emitter follower circuit, to obtain a level-amplified output signal from an emitter of the output transistor. The speed of an operation of the circuit device can be increased to a high level owing to a simple circuit in which a level, which is required to attain an output amplitude, of complementary output signals is secured by the current switch circuit, the amplified complementary signals being inputted into the emitter follower circuit to directly drive the output transistor.

Semiconductor integrated circuit device and memory consisting of

The disclosure includes feeding a current I.sub.R to only BIT lines selected, or feeding current I.sub.R transiently to only the BIT lines switched from unselected to selected states; and a sense amplifier for detecting the difference between the currents flowing in selected BIT lines to read out stored information, wherein current I.sub.R and cell current I.sub.cell have a relation of I.sub.R &gt;I.sub.cell. The BiC MOS memory has high speed, low power and high integration density. Diodes are provided between the memory cell and the BIT lines.

Semiconductor cell memory with current sensing

A semiconductor circuit having a plurality of circuit blocks, each having latch circuits each one thereof being controlled by an internally provided clock signal for preventing malfunction of the circuit. Each circuit is provided with the latch function so that the cycle time is made shorter than the access time. Moreover, the latch means are driven in such a manner that the adjoining ones are prevented from being put to through-state simultaneously, whereby malfunction is prevented.

Semiconductor device having latch means

A semiconductor memory device is provided such as the type having flip-flop memory cells each including two bipolar transistors in cross connection with each other. In certain embodiments, at least a part of a Schottky barrier diode or capacitor in the memory cell is formed under a digit line. This memory device is greatly reduced in its required area, and the Schottky barrier diode and capacitor are negligibly influenced by the digit line. In other embodiments, it is arranged to provide different electrodes for the Schottky barrier diode and the capacitor to optimize construction in a minimized space.

Semiconductor memory device

Herein disclosed is a bipolar memory having redundancy, which can be produced with a small area. In this semiconductor memory having a body memory for storing data and a spare memory for relief of fault bit of the body memory, a row is selected by cutting fuses in a decoder. Fundamentally signal lines such as word lines are not provided with fuses. Other parts including a power source and a reference voltage source are provided with fuses without decreasing the operating speed accompanied by only a slight increase in the area.

Semiconductor memory having redundancy

Growing community of inventors

Sayama, Japan

Kunihiko Yamaguchi