Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Kunihiko Obara

Toshihide Maeda

Hideo Nagai

Tomio Inoue

Hidenori Kamei

Hiromi Kitahara

Kenichi Koya

Yoshirou Tooya

Mineo Tokunaga

Koichi Nakahara

Yoshiyuki Ide

Kouji Nakatsu

Takahiro Shirahata

Isamu Yonekura

Toshirou Kitazono

Koji Nakatsu

Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

Semiconductor light-emitting device and manufacturing method of the same

A semiconductor light emitting device comprises an element that emits light and a substrate on a main surface of which the element is mounted. The main surface of the substrate composed of two areas, (i) a mount area which is rectangle and on which the element is mounted, and (ii) a pad area that is equipped with a pad for wire bonding. The pad area is contiguous to the mount area on one side of the mount area, and the pad area decreases in width continuously or stepwise in a direction away from the one side.

Semiconductor light emitting device

A lighting apparatus of the present invention comprises: a substrate; a semiconductor light emitting device mounted on the substrate; a resin layer formed on a mounting surface of the substrate and having a lens portion that seals the semiconductor light emitting device; and a reflecting plate. Here, the reflecting plate and the resin layer are positioned with a space therebetween. Herewith, it is possible to offer a lighting apparatus which (i) has high luminance, (ii) causes sufficient heat release, and (iii) is less likely to cause detachment of the resin layer.

Lighting apparatus

A composite light-emitting device according to the present invention includes a light-emitting element including a transparent substrate and a multilayer structure formed on the substrate. The multilayer structure includes first and second semiconductor layers of first and second conductivity types, respectively. The device further includes a submount member for mounting the light-emitting element thereon. The principal surface of the submount member faces the multilayer structure. The submount member is electrically connected to the light-emitting element. The light-emitting element is covered with a wavelength-shifting resin member. The resin member is provided on the principal surface of the submount member and contains a photofluorescent or filtering compound. The photofluorescent compound shifts the wavelength of radiation that has been emitted from the light-emitting element, while the filtering compound partially absorbs the radiation.

Composite light-emitting device, semiconductor light-emitting unit and method for fabricating the unit

Method for fabricating semiconductor light-emitting unit

Growing community of inventors

Kagoshima, Japan

Kunihiko Obara