Shin-etsu Chemical Co., Ltd.

Kunihiko Mita

Kunihiro Yamada

Tsutomu Yoneyama

Kazuhiko Tomaru

Yoshitaka Aoki

Hiroaki Tetsuka

Hironao Fujiki

Akihiro Endo

Akio Suzuki

Takeshi Fukuda

Akio Nakano

Hiroaki Kizaki

Ikuo Sakurai

Kenichi Takita

A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm/s at 25&#xb0; C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m&#xb0; C. and an average particle size of 0.1-15.0 &#x3bc;m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.

Silicon grease compositions

A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Heat dissipating member

An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.

Heat conductive composite sheet and process for producing same

Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70&#xb0; C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 &#x3bc;m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

Curable organopolysiloxane composition and semiconductor device

A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Radiating structural body of electronic part and radiating sheet used for the radiating structural body

A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &#x3bc;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &#x3bc;m. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250&#xb0; C. and a particle diameter of 0.1-100 &#x3bc;m, together with a thermally-conducting powder (2) having a melting temperature exceeding 250&#xb0; C. and an average particle diameter of 0.1-100 &#x3bc;m, such that (1)/[(1)+(2)]=0.2-1.0.

Heat-dissipating member, manufacturing method and installation method

The present invention relates to a thermoconducting silicone composition having a viscosity at 25&#xb0; C. before curing of 10-1,000 Pa&#xb7;s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.

Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same

A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.

Heat dissipating structure

In a fluorosilicone rubber composition comprising (A) an organopolysiloxane having trifluoropropyl and (B) a silica filler, there are included (C) an organic peroxide of percarbonate type as a crosslinking agent and (D) a compound having a molecular weight of up to 10,000 and bearing in a molecule at least two substituents selected from among allyl, acryloyl, methacryloyl, epoxy and alkoxy groups as a co-crosslinking agent, whereby the vulcanization molding time is substantially reduced without detracting from physical properties.

Fluorosilicone rubber compositions

An electroconductive silicone rubber having a high electroconductivity and retaining the good workability in compounding and molding and excellent properties inherent in silicone rubbers in general can be obtained by compounding a curable organopolysiloxane composition comprising a gum-like diorganopolysiloxane, carbon black as a conductivity-imparting agent and a curing agent with a cured silicone rubber powder of spherical particle configuration having specified particle diameter and specified sphericity which partially replaces the diorganopolysiloxane gum.

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Gunma-ken, Japan

Kunihiko Mita