Murata Manufacturing Co., Ltd.

Kunihiko Hamada

Hidekiyo Takaoka

Satoru Noda

Yukio Sanada

Masaki Fujiyama

Shinichiro Kuroiwa

Takashi Hiramatsu

Takeshi Miki

Yu Tokuda

Akira Otani

Hiromasa Takahashi

Akihiro Motoki

Yoshihiko Takano

Takayuki Kayatani

Kiyotaka Maegawa

Akira Ohtani

Shoichi Higuchi

Shigehiro Nojiri

Satoshi Shindou

Kazuma Tanaka

Tatsuya Todo

Mika Yamamoto

In a ceramic electronic component, a first internal electrode includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section is connected to a first external electrode. The number of cross-linked sections per unit area in the first extraction section is less than the number of cross-linked sections per unit area in the first opposed section.

Method for manufacturing ceramic electronic component and ceramic electronic component including cross-linked section

A ceramic electronic component includes a first internal electrode that includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section includes a first thick section. The first thick section is thicker than a first central section of the first opposed section. The first opposed section includes a first base end section opposed to a second tip section of the second internal electrode closer to the first end surface, with the ceramic layer interposed therebetween, and the first base end section includes a first thin section. The first thin section is thinner than the first central section.

Ceramic electronic component

In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about &#xbc; to about &#xbe; of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

Ceramic electronic component including internal electrode with thick section

A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.

Thick film electrode and multilayer ceramic electronic device

A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component

A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.

Method for plating electrodes of ceramic chip electronic components

Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

Pb-free solder composition and soldered article

A ceramic electronic part includes a ceramic assemblage containing laminated plural ceramic sheets, plural inner electrodes formed between the ceramic sheets and containing Ni as a major component, and outer electrodes electrically connected to the inner electrodes. The outer electrodes contain Ag as a major component and Au and an inorganic oxide as minor components.

Ceramic electronic parts and method for manufacturing the same

A ceramic electronic component includes a ceramic body; terminal electrodes formed on the ceramic body; and lead terminals joined to the terminal electrodes with solder containing Sn. Each terminal electrode includes a first electrode layer formed on the ceramic body and a second electrode layer formed on the first electrode layer. The second electrode layer contains a conductive constituent containing at least Zn, Ag and/or Cu, and Sn. The Zn content in the second electrode layer is about 4% by weight or more in relation to 100% by weight of the conductive constituent and is within the solubility limit not forming AgZn and/or CuZn intermetallic compounds.

An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90&deg; or less as measured in a nitrogen atmosphere.

Electrically conductive paste and electronic element

A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called &ldquo;adhesion defect&rdquo; is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni, a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.

Conductive paste and ceramic electronic component

A laminated ceramic capacitor is provided having superior elastic and bending characteristics and having a high mechanical strength withstanding the thermal shock generated when mounting is performed on a circuit substrate by soldering. The laminated ceramic capacitor is composed of a laminate and external electrodes, wherein the laminate is formed of a plurality of ceramic layers and a plurality of internal electrodes provided therebetween so that an end of each internal electrode is exposed at one of edge surfaces of the laminate, and the external electrodes are connected to the internal electrodes and contains a conductive component and a glass having a Young's modulus of about 9&times;10 Pa or less.

Laminated ceramic electronic device

There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.

Soldered article

Disclosed is an electroconductive paste and a laminated ceramic electronic part produced by the use of the paste. The part exhibits improved heat-shock resistance during surface mounting thereof. The paste comprises a metal component and glass frit dispersed in an organic vehicle, and the glass frit comprises a zinc borosilicate containing CaO. The proportion of CaO to the total weight of the glass frit is preferably about 3 to 15 wt. %. The laminated ceramic electronic part comprises outer electrodes formed on the sides of the body of the part by baking the paste thereon.

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Kyoto, Japan

Kunihiko Hamada