Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Kuniaki Yosui

Hiroyuki Kubo

Hiromitsu Ito

Noboru Kato

Takahiro Baba

Naoki Gouchi

Nobuo Ikemoto

Shinichi Nakano

Shingo Ito

Kosuke Nishino

Jun Sasaki

Yuki Wakabayashi

Naoto Ikeda

Yuki Ito

Bunta Okamoto

Wataru Tamura

Satoshi Ishino

Shigeru Tago

Isamu Morita

Keisuke Ikeno

Shuichi Kezuka

Hirokazu Yazaki

Takeshi Kurihara

Yasuko Yoshinaga

Satoshi Sasaki

Hirofumi Shinagawa

Eiichi Kobayashi

Toshiro Adachi

Masaki Kawata

Fumie Matsuda

Hiroyuki Irikawa

Hirotsugu Mori

Takashi Noma

Kengo Onaka

Katsumi Taniguchi

Nobuyuki Tenno

Masahiro Ozawa

Gota Shinohara

Hisashi Akiyama

Kiyoyasu Sakurada

Kanto Iida

Noriko Shimizu

Masaki Kitajima

Yoichi Nakatsuji

Yasushi Takeda

Hironori Suzuki

Junji Kurobe

Keiichi Hirose

Yoshiyuki Mashimo

Genro Kato

Shinya Oguri

Wataru Yanase

Masanori Kasai

Hiromu Fukushima

Kazutaka Muraoka

Daisuke Tonaru

Hideyuki Taguchi

Hirohumi Shinagawa

Zhujun Yang

Kazufumi Aisu

A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.

Multilayer substrate and a manufacturing method of the multilayer substrate

A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.

Multilayer substrate and method for manufacturing the same

A transmission line includes connecting portion connected to the outside and a main body connected to the connecting portion. The connecting portion includes a terminal electrode connected to an external electrode, a signal conductor, and a ground conductor. The main body includes the signal conductor and the ground conductor. The connecting portion includes a first region including the terminal electrode, a second region adjacent to the first region along a signal transmission path, and a third region located between the second region and the main body. Impedance matching at the at least one of the connecting portions is achieved by the first region, the second region, and the third region.

Transmission line and mounting structure thereof

A circuit board includes a first circuit board portion and a second circuit board portion. The first circuit board portion is provided with a first transmission line for a low-frequency signal or a low-speed signal, and the second circuit board portion is provided with a second transmission line for a high-frequency signal or a high-speed signal. The second circuit board portion is located on the first circuit board portion in a positional relationship in which the first transmission line and the second transmission line are side-by-side with each other. With this structure, signal leakage and interference between different signals are reduced or prevented in a line that transmits signals with different frequencies and different transmission speeds.

Circuit board and electronic device

An actuator includes a coil substrate including a coil, a base substrate including a coil drive circuit, and a magnet to receive a magnetic field generated by the coil. A magnetic sensor is mounted on the coil substrate. The coil substrate on which the magnetic sensor is mounted is connected to the base substrate through a conductive bonding material.

Actuator and method of manufacturing actuator

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

Coil-incorporated multilayer substrate and method for manufacturing the same

In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.

Built-in-coil substrate and method for manufacturing the same

A multilayer board includes a flexible substrate including insulating layers stacked and a pair of through-holes penetrating the insulating layers, and an interlayer connecting conductor in an opposing region in which the pair of through-holes opposes each other in a plan view of the insulating layers viewed from a stacking direction. A cross section of the flexible substrate taken in a lateral direction passing through the pair of through-holes and the interlayer connecting conductor and the stacking direction has a U or S shape. In the cross section, a curvature radius of an inner region located between the pair of through-holes is larger than a curvature radius of an outer region adjacent to the pair of through-holes on an outer side thereof.

Multilayer board and connecting structure of the same

A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.

Multilayer substrate and method of producing multilayer substrate

A multilayer substrate includes an element assembly including insulating layers stacked along a layer stacking axis including a first direction and a second direction, and a coil disposed at the element assembly. The coil includes a spiral of two or more turns when viewed from the layer stacking axis and extending along the layer the first direction while spiraling from outside inward. A portion of the coil defining an outermost turn of the spiral is defined as a first coil portion, an inner portion of the coil that is the nnearest from the first coil portion is defined as an n+1coil portion, and a space between the ncoil portion and the n+1coil portion is defined as an nspace, where n is a natural number.

Multilayer substrate and method for manufacturing same

An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.

Electronic device

An antenna module according to an embodiment of the present disclosure includes a dielectric substrate, a first antenna element, a first radio-frequency element, and a first heat-dissipating component. The first antenna element is provided on the dielectric substrate. The first radio-frequency element supplies electric power to the first antenna element. The first heat-dissipating component directs heat from the first radio-frequency element to the outside. The dielectric substrate, the first radio-frequency element, and the first heat-dissipating component are stacked in this order in the Z-axis direction, which is the direction normal to the dielectric substrate. The first heat-dissipating component includes metal. The first heat-dissipating component has a first width at its first position that differs from a second width at its second position located away from the first position in the Z-axis direction.

Antenna module

A stacked body includes a base including a plurality of insulating base material layers, a coil including a winding-shaped conductive pattern located on at least one of the plurality of the insulating base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the coil on at least one of the plurality of the insulating base material layers in a plan view, wherein the stacked body includes a step at which a thickness of the stacked body is different in a stacking direction, and the dummy pattern is located between the coil and the step at a portion defining the step where the thickness of the stacked body is larger.

Stacked body and method of producing stacked body

A transmission line includes connecting portions connected to the outside and a main body located between the connecting portions. Each of the connecting portions includes a terminal electrode connected to an external electrode, a signal conductor, and ground conductors. The main body includes the signal conductor and the ground conductors, and at least one of the plurality of connecting portions includes a first region including the terminal electrode, a second region adjacent to the first region along a signal propagation path, and a third region located between the second region and the main body. The first region, the second region, and the third region provide impedance matching at the connecting portion.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other

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Nagaokakyo, Japan

Kuniaki Yosui