Hitachi Chemical Company, Ltd.

Hitachi Chemical Company, Co.

Kuniaki Satou

Toshizumi Yoshino

Haruaki Sue

Hideji Kuwajima

Takao Hirayama

Takashi Amano

Tsutomu Mamiya

Nobuhito Komuro

Shinya Oosaki

Osamu Matsuzaka

Jun-ichi Kikuchi

Takahiko Kutsuna

Mikio Uzawa

Akira Hironaka

The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound, and (E) a photopolymerizable compound, wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol-novolak epoxy resin (a1) having a structural unit represented by a general formula (IV) or (V), and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) differing from the epoxy resin (a1).

Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board

The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness. 

Phenol resin and resin composition

The present invention provides an electroconductive paste that can contain a high proportion of an electroconductive powder, has excellent electroconductivity reliability and migration resistance, has a highly competitive price due to a reduced amount of silver plating, and is suitable for use in solder electrode formation, an electroconductive adhesive, etc. The electroconductive paste of the present invention comprises a binder and an electroconductive powder containing 80 to 97 wt % of a substantially spherical silver-coated copper powder in which the surface of a copper powder is coated with silver and the surface thereof is further coated with 0.02 to 0.5 wt % relative to the copper powder of a fatty acid, and 3 to 20 wt % of a flat-shaped silver-coated copper powder in which the surface of a copper powder is coated with silver and the surface thereof is further coated with 0.02 to 1.2 wt % relative to the copper powder of a fatty acid.

Conductive paste

Disclosed are a photosensitive resin composition comprising a photosensitive resin (A), a photopolymerization initiator (B), and a flame retardant (C), in which a content of halogen atoms or antimony atoms in the flame retardant is 5% or less by weight; a photosensitive element using this; a method of manufacturing a resist pattern; a resist pattern; and a resist pattern laminated substrate.

Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon

There are disclosed a resin composition for coating which comprises a mixture of

Resin composition for coating and paint

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Yuki, Japan

Kuniaki Satou