Hitachi Chemical Company, Ltd.

Kuniaki Sato

Takao Hirayama

Toshihiko Ito

Toshizumi Yoshino

Hiroaki Hirakura

Nobuyuki Hayashi

Toshiaki Ishimaru

Hideji Kuwajima

Tohru Kikuchi

Shigeo Tachiki

Yasunori Kojima

Mitsumasa Kojima

Junichi Kikuchi

A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film

A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Photo curable resin composition and photosensitive element

A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper toil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper toil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.

Through-hole wiring board

A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.

Photosensitive resin composition

A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.

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Ibaraki-ken, Japan

Kuniaki Sato