Okuno Chemical Industries Co., Ltd.

Kuniaki Otsuka

Koji Kita

Shingo Nagamine

Eiichi Torikai

Shigemitsu Kawagishi

Junichi Katayama

Kenji Hara

Kazuyoshi Okuno

Shigeru Yamato

Satoshi Konishi

Kazue Yamamoto

Takamitsu Tsujimoto

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

Resin plating method

The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3): The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.

Composition for etching treatment of resin material

Method for direct-electroplating an electrically nonconductive substrate

An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.

Electroless palladium plating composition

Growing community of inventors

Osaka, Japan

Kuniaki Otsuka