Rohm Co., Ltd.

Kuniaki Nakamura

Takumi Yamade

Yasuyuki Aritaki

Tadatoshi Miwa

Naoki Sekiguchi

Hideki Sawada

Hiroaki Onishi

Kaoru Muraki

A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

Thermal print head, thermal printer, and method of manufacturing heat sink

An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Image sensor module

An image sensor module includes an elongated light emitting unit, a photodetector, a lens unit, a substrate with the photodetector mounted on. The substrate is spaced apart from the lens unit in a thickness direction of the substrate. The image sensor module further includes a resin case provided with a light emitting unit chamber, a lens unit chamber and a substrate chamber. The lens unit chamber has a first bottom face extending in the first direction, and the substrate chamber has a second bottom face extending in the first direction and facing opposite to the first bottom face in the thickness direction of the substrate. The first or second bottom face is formed with at least one protrusion extending in the thickness direction of the substrate.

A sensor IC of the present invention is provided with plurality of light receiving portions arranged in a row along a primary scanning direction and including a first light receiving portion for receiving light of a first wavelength, a second light receiving portion for receiving light of a second wavelength different from the first wavelength, and a third light receiving portion for receiving light of a third wavelength different from the first wavelength and the second wavelength. The sensor IC further includes a control circuit that outputs a first electric signal corresponding to light of the first wavelength received by the first light receiving portion, a second electric signal corresponding to light of the second wavelength received by the second light receiving portion, and a third electric signal corresponding to light of the third wavelength received by the third light receiving portion.

Sensor IC, contact image sensor and image reading apparatus

An image reading device and a method for manufacturing the same are provided, where the image reading device is capable of being assembled more efficiently. The image reading device includes: an optical part, extending long in a direction; a case, having an accommodating portion for accommodating the optical part; and a light receiving component, accommodated in the case. The optical part is fixed in the accommodating portion through a first adhesive and a second adhesive with hardening time longer than that of the first adhesive.

Image reading device and method for manufacturing the same

A semiconductor light emitting module is provided with a supporting conductor including a die bonding pad, and with a plurality of semiconductor light emitting elements bonded to the die bonding pad. The semiconductor light emitting elements are arranged in series along an arrangement line extending in a first direction. The die bonding pad includes a portion overlapping alternative die-bonding positions which are symmetrical to positions of the bonded semiconductor light emitting elements with respect to a line of symmetry extending in a second direction different from the first direction.

Growing community of inventors

Kyoto, Japan

Kuniaki Nakamura